PCX7457VGH1000NC Atmel, PCX7457VGH1000NC Datasheet - Page 36

• Manufacturer Part Number: PCX7457VGH1000NC
• Description: IC MPU 32BIT 1000MHZ 483CBGA
• Manufacturer: Atmel

Specifications of PCX7457VGH1000NC

• Processor Type: PowerPC 32-Bit RISC
• Speed: 1.0GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 483-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

8. Preparation for Delivery
8.1
8.2
36
Handling
Package Parameters for the PC7457, 483 CBGA and 483 HCTE
PC7457
MOS devices must be handled with certain precautions to avoid damage due to accumulation of
static charge. Input protection devices have been designed in the chip to minimize the effect of
static buildup. However, the following handling practices are recommended:
The package parameters are as provided in the following list. The package type is 29
483-lead ceramic ball grid array (CBGA and HCTE).
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion
Figure 8-1
top surface.
Figure 8-2
the top surface view.
• Devices should be handled on benches with conductive and grounded surfaces
• Ground test equipment, tools and operator
• Do not handle devices by the leads
• Store devices in conductive foam or carriers
• Avoid use of plastic, rubber or silk in MOS areas
• Maintain relative humidity above 50% if practical
shows the pinout of the PC7457, 483 CBGA and HCTE packages as viewed from the
shows the side profile of the CBGA and HCTE packages to indicate the direction of
483 (22 × 22 ball array - 1)
–
3.22 mm
12.3 ppm/ C (HCTE - CBGA)
1.27 mm (50 mil)
0.89 mm (35 mil)
6.8 ppm/ C (CBGA)
29 mm × 29 mm
5345D–HIREL–07/06
×
29 mm,