MC7448HX600NC Freescale Semiconductor, MC7448HX600NC Datasheet - Page 31

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MC7448HX600NC

Manufacturer Part Number
MC7448HX600NC
Description
IC MPU RISC 32BIT 360-FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC7448HX600NC

Processor Type
MPC74xx PowerPC 32-Bit
Speed
600MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
360-FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC7448HX600NC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
8.3
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 pin
high coefficient of thermal expansion ceramic land grid array (HCTE).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Pad diameter
Coefficient of thermal expansion12.3 ppm/°C
Package Parameters for the MPC7448, 360 HCTE LGA
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
1.52 mm
1.80 mm
0.89 mm (35 mil)
Package Description
31

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