LTC4266CGW#PBF Linear Technology, LTC4266CGW#PBF Datasheet - Page 28

• Manufacturer Part Number: LTC4266CGW#PBF
• Description: IC CTRLR IEEE 802.3AT 36-SSOP
• Manufacturer: Linear Technology

Specifications of LTC4266CGW#PBF

• Controller Type: Ethernet Controller (IEEE 802.3)
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 3.3V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 36-SSOP
• Input Voltage: 3.3V
• Supply Current: -2.4mA
• Digital Ic Case Style: SSOP
• No. Of Pins: 36
• Duty Cycle (%): 60%
• Uvlo: 25V
• Frequency: 1MHz
• Operating Temperature Range: 0°C To +70°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Pin Count: 36
• Mounting: Surface Mount
• Package Type: SSOP
• Screening Level: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Lead Free Status / Rohs Status: Compliant

LTC4266
PACKAGE DESCRIPTION
28
7.00 ± 0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 ± 0.05
OUTLINE M0-220 VARIATION WHKD
4.10 ± 0.05
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 REF
5.00 ± 0.10
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.15 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
(Reference LTC DWG # 05-08-1701 Rev C)
38-Lead Plastic QFN (5mm × 7mm)
5.15 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 ± 0.05
6.10 ± 0.05
7.50 ± 0.05
0.75 ± 0.05
5.5 REF
UHF Package
5.50 REF
0.200 REF
0.00 – 0.05
0.50 BSC
0.25 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 ± 0.05
5.15 ± 0.10
PACKAGE
OUTLINE
3.15 ± 0.10
3.00 REF
R = 0.125
TYP
37
38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
R = 0.10
TYP
0.40 ±0.10
1
2
(UH) QFN REF C 1107
4266fb