MCP2021-500E/MD Microchip Technology, MCP2021-500E/MD Datasheet - Page 22

• Manufacturer Part Number: MCP2021-500E/MD
• Description: IC LIN TXRX ON-BOARD VREG 8DFN
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2021-500E/MD

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 8-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC164130 - BOARD DAUGHT PICTL PLUS ECAN/LIN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP2021/2
2.3
2.4
DS22018E-page 22
AC CHARACTERISTICS
Voltage Regulator
Bus Activity Debounce time
Bus Activity to Voltage
Regulator Enabled
Voltage Regulator Enabled
to Ready
Chip Select to Operation
Ready
Chip Select to Power-down
Short circuit to shut-down
RESET Timing
V
inactive
V
active
Note 1:
THERMAL CHARACTERISTICS
Recovery Temperature
Shutdown Temperature
Short Circuit Recovery Time
Thermal Package Resistances
Thermal Resistance, 8L-DFN
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
Note 1:
REG
REG
OK detect to RESET
OK detect to RESET
AC Specification (Continued)
Thermal Specifications
Parameter
Time depends on external capacitance and load.
The maximum power dissipation is a function of T
allowable power dissipation at an ambient temperature is P
exceeded, the die temperature will rise above 150°C and the MCP2021 will go into thermal shutdown.
Parameter
V
t
SHUTDOWN
BB
t
BACTVE
t
t
t
Sym
CSOR
CSPD
t
t
t
VEVR
RPU
RPD
= 6.0V to 18.0V; T
BDB
θ
θ
SHUTDOWN
RECOVERY
Symbol
t
THERM
θ
θ
θ
θ
θ
θ
JA
JA
JA
JA
JA
JA
Min.
100
20
—
—
—
—
—
5
A
149.5
+140
+150
35.7
89.3
95.3
Typ
100
1.5
= -40°C to +125°C
70
Typ.
250
10
—
—
—
—
—
—
JMAX
Max
5.0
, Θ
—
—
—
—
—
—
—
—
1200
Max.
10.0
10.0
JA
500
500
100
20
80
D
and ambient temperature T
= (T
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ms
°C
°C
JMAX
Units
µs
µs
µs
µs
µs
µs
µs
µs
- T
A
) Θ
Bus debounce time
After Bus debounce time
(Note 1)
(Note 1)
© 2009 Microchip Technology Inc.
JA
. If this dissipation is
Test Conditions
Test Conditions
A
. The maximum