MCP2021-500E/MD Microchip Technology, MCP2021-500E/MD Datasheet - Page 41

• Manufacturer Part Number: MCP2021-500E/MD
• Description: IC LIN TXRX ON-BOARD VREG 8DFN
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2021-500E/MD

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 8-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC164130 - BOARD DAUGHT PICTL PLUS ECAN/LIN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision E (February 2009)
The following is the list of modifications.
1.
2.
3.
4.
5.
6.
7.
Revision D (July 2008)
The following is the list of modifications.
1.
2.
3.
Revision C (April 2008)
The following is the list of modifications.
1.
2.
3.
4.
5.
© 2009 Microchip Technology Inc.
Added Example 1-2 and Example 1-3.
Updated Section 1.5.9 “RESET”.
Updated
ations”.
Updated Section 2.1 “Absolute Maximum
Ratings†”.
Updated Section 2.2 “DC Specifications” and
Section 2.3 “AC Specification”.
Added FIGURE 2-3: “ESR Curves For Load
Capacitor Selection”.
Updated the Product Identification System
section.
Updated ESD specs under ‘Absolute DC’.
Updated notes in Example 1-1.
Updated Package Outline Drawings.
Added LIN2.1 and J2602 compliance statement
to Features section.
Added recommended RC network for CS/
LWAKE in Example 1-1.
Updated 2.1 Absolute Maximum Ratings to
reflect current test results.
Updated 2.2 DC Specifications and 2.3 AC
Specifications to reflect current production
device.
Added 8-Lead SOIC Landing Pattern Outline
drawing.
Section 1.7
REVISION HISTORY
“ICSP™
Consider-
Revision B (August 2007)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Revision A (November 2005)
• Original Release of this Document.
Modified Block Diagram on page 2.
Section 1.3.5
Deleted text in 1st paragraph.
Example 1-1: Removed +5V notation.
Section 1.5 “Pin Descriptions”: Removed 10-
pin DFN, MSOP column from table.
Section 1.5.8 “Fault/TXE”: Deleted text from
2nd paragraph.
Section 3.0 “Packaging Information”: Added
8-lead 4x4 and 6x5 DFN and 14-lead TSSOP
packages. Updated package outline drawings
and added drawings for 8-lead DFN and 14-lead
TSSOP drawings.
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