BFY740B (P) Infineon Technologies, BFY740B (P) Datasheet

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BFY740B (P)

Manufacturer Part Number
BFY740B (P)
Description
RF Germanium HiRel
Manufacturer
Infineon Technologies
Datasheet

Specifications of BFY740B (P)

Package
Micro-X
Comment
also available in (S) and (H) quality
Vceo (max)
4.0 V
Ic(max)
30.0 mA
Ptot (max)
120.0 mW
Lead Free Status / Rohs Status
No
Other names
BFY740BPNZ
HiRel NPN Silicon Germanium RF Transistor
ESD: Electrostatic discharge sensitive device,
observe handling precautions!
Maximum Ratings
Thermal Resistance
Notes.:
1) For T
2) T
IFAG IMM RPD D HIR
Type
BFY740B
Parameter
Collector-emitter voltage
T
T
Collector-base voltage
Emitter-base voltage
Collector current
Base current
Junction temperature
Operating temperature range
Storage temperature range
Junction-soldering point
a
a
HiRel Discrete and Microwave Semiconductor
High gain ultra low noise RF transistor
Outstanding noise figure F = 0.7 dB at 1.8 GHz
Outstanding noise figure F = 1.0 dB at 6 GHz
Hermetically sealed microwave package
S
> 0 °C
≤ 0 °C
is measured on the emitter lead at the soldering point to the pcb.
S
≤ 125°C. For T
1)
S
> 125 °C derating is required
2)
Marking
-
Pin Configuration
C
.
1
Symbol
V
V
V
I
I
T
T
T
R
C
B
j
op
stg
CEO
CBO
EBO
th JS
1 of 3
E
2
Values
4.0
3.5
13
1.2
30
3
175
-65...+175
-65...+175
400
B
3
4
1
4
E
Package
Micro-X
BFY740B
V2, August 2011
Unit
V
V
V
V
mA
mA
C
C
C
K/W
3
2

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BFY740B (P) Summary of contents

Page 1

HiRel NPN Silicon Germanium RF Transistor  HiRel Discrete and Microwave Semiconductor  High gain ultra low noise RF transistor  Outstanding noise figure 1.8 GHz Outstanding noise figure ...

Page 2

Electrical Characteristics at T =25°C; unless otherwise specified A Parameter DC Characteristics Collector-base cutoff current Collector-emitter cutoff current 0.1 µ Emitter-base cuttoff current ...

Page 3

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. ...

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