MT36HTF51272FZ-667H1D6 Micron Technology Inc, MT36HTF51272FZ-667H1D6 Datasheet
MT36HTF51272FZ-667H1D6
Specifications of MT36HTF51272FZ-667H1D6
Related parts for MT36HTF51272FZ-667H1D6
MT36HTF51272FZ-667H1D6 Summary of contents
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... DDR2 SDRAM FBDIMM MT36HTF51272FZ – 4GB For the component data sheets, refer to Micron’s Web site: Features • 240-pin, fully buffered dual in-line memory module (FBDIMM) • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 4GB (512 Meg x 72) • 3.2 Gb/s, 4 Gb/s, and 4.8 Gb/s link transfer rates • ...
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... Notes: 1. Data sheets for the base device can be found on Micron’s Web site. 2. All part numbers end with a four-place code (not shown), designating component, PCB, and AMB revisions. Consult factory for current revision codes. Example: MT36HTF51272FZ-667H1N8. PDF: 09005aef83d491e1Source: 09005aef83d49311 htf36c512x72fz.fm - Rev. A 11/09 EN ...
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... Serial Presence-Detect (SPD) for Fully Buffered DIMM – JEDEC Standard No. 21-C page 4.1.2.7-1 The MT36HTF51272FZ DDR2 SDRAM module is a high-bandwidth, large-capacity channel solution that has a narrow host interface. FBDIMMs use DDR2 SDRAM devices isolated from the channel behind an AMB buffer on the FBDIMM. Memory-device capacity remains high and total memory capacity scales with DDR2 SDRAM bit density ...
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Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...
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... The M_TEST pin provides an external connection for testing the margin of V produced by a voltage divider on the module not intended to be used in normal system operation and must not be connected (DNU system. This test pin may have other features on future card designs and will be included in this specification at that time. ...
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... Block Diagrams Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component Up to eight modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc., reserves the right to change products or specifications without notice. ...
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Figure 3: Functional Block Diagram V SS RS0# RS1# DQS0 DQS0# DQ0 DQ1 DQ2 DQ3 DQS1 DQS1# DQ8 DQ9 DQ10 DQ11 DQS2 DQS2# DQ16 DQ17 DQ18 DQ19 DQS3 DQS3# DQ24 DQ25 DQ26 DQ27 DQS4 DQS4# DQ32 DQ33 DQ34 DQ35 DQS5 ...
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... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the DRAM devices on the module. This is a stress rating only and functional operation of the mod- ule at these or any other conditions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...
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Table 8: AMB Clock Ratios FBDIMM Data Rate DDR Data Link 4.0 Gb/s 666 Mb/s 4.8 Gb/s 800 Mb/s I Specifications and Conditions DD Table 9: I Conditions DD Symbol Condition I _Idle_0 Idle current, single, or last DIMM: Low ...
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Serial Presence-Detect Table 12: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition EEPROM and AMB supply voltage Input high voltage: Logic 1; all inputs Input low voltage: Logic 0; all inputs Output low voltage ...
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... TYP Front view with heat spreaders U6 U8 U11 U13 Back view with heat spreaders U26 U28 U32 U27 U29 U38 11 Module Dimensions 5.1 (0.201) 2 (0.079) U14 U16 TYP 30.5 (1.201) 30.2 (1.189) U15 U17 17.3 (0.681) TYP 9.5 (0.374) TYP 1.37 (0.054) 1 ...