MT9HTF12872RHZ-80EH1 Micron Technology Inc, MT9HTF12872RHZ-80EH1 Datasheet

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MT9HTF12872RHZ-80EH1

Manufacturer Part Number
MT9HTF12872RHZ-80EH1
Description
MODULE DDR2 SDRAM 1GB 200SORDIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT9HTF12872RHZ-80EH1

Memory Type
DDR2 SDRAM
Memory Size
1GB
Speed
800MT/s
Features
-
Package / Case
200-SORDIMM
Lead Free Status / Rohs Status
Supplier Unconfirmed
DDR2 SDRAM SORDIMM
MT9HTF12872RHZ – 1GB
Features
• 200-pin, small-outline registered dual in-line memo-
• Fast data transfer rates: PC2-4200, PC2-5300, or
• 1GB (128 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent opera-
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Phase-lock loop (PLL) to reduce system clock line
• Gold edge contacts
• Single rank
• Halogen-free
Table 1: Key Timing Parameters
PDF: 09005aef83ebee86
htf9c128x72rhz – Rev. A 3/10 EN
ry module
PC2-6400
tion
loading
Speed
Grade
DD
DDSPD
-80E
-800
-667
-53E
-40E
= V
DDQ
= 3.0–3.6V
= 1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
t
CK
CL = 6
800
800
CL = 5
Data Rate (MT/s)
800
667
667
1GB (x72, SR) 200-Pin DDR2 SDRAM SORDIMM
1
Figure 1: 200-Pin SORDIMM (R/C A)
Module height: 30mm (1.181 in)
CL = 4
Options
• Operating temperature
• Package
• Frequency/CAS latency
533
533
553
553
400
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin DIMM (hsalogen-free)
– 2.5 @ CL = 5 (DDR2-800)
– 2.5 @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency; registered mode
CL = 3
400
400
400
400
400
module offerings
will add one clock cycle to CL.
t
(ns)
12.5
RCD
15
15
15
15
1
A
A
2
≤ +85°C)
≤ +70°C)
© 2010 Micron Technology, Inc. All rights reserved.
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-80E
-800
-667
(ns)
t
55
55
55
55
55
Z
RC
I

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MT9HTF12872RHZ-80EH1 Summary of contents

Page 1

... DDR2 SDRAM SORDIMM MT9HTF12872RHZ – 1GB Features • 200-pin, small-outline registered dual in-line memo- ry module • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 1GB (128 Meg x 72) • Supports ECC error detection and correction • 1.8V DD DDQ • 3.0–3.6V DDSPD • ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT9HTF12872RHZ-80EG1. PDF: 09005aef83ebee86 htf9c128x72rhz – Rev. A 3/10 EN ...

Page 3

Pin Assignments Table 4: Pin Assignments 200-Pin SORDIMM Front Pin Symbol Pin Symbol Pin DQ18 101 REF 3 DQ0 53 DQ19 103 105 DQ1 57 DQ24 107 9 DQS0# 59 ...

Page 4

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 5: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 5

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 5 Pin Descriptions and V ...

Page 6

Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DM CS# DQ DQS# DQ DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM CS# DQ DQS# DQ ...

Page 7

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 8

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 9

... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 7: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...

Page 10

IDD Specifications Table 8: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one bank ...

Page 11

Register and PLL Specifications Table 9: Register Specifications SSTU32872 devices or equivalent Parameter Symbol DC high-level V Control, command, IH(DC) input voltage DC low-level V Control, command, IL(DC) input voltage AC high-level V Control, command, IH(AC) input voltage AC low-level ...

Page 12

Table 10: PLL Specifications CUA845 device or JEDEC82-21 equivalent Parameter Symbol DC high-level V IH input voltage DC low-level V IL input voltage Input voltage (limits Input differential-pair V IX cross voltage Input differential volt- V ID(DC) age ...

Page 13

... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 12: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...

Page 14

The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...

Page 15

Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 14: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...

Page 16

Table 15: Pointer Register Bits 0– Table 16: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...

Page 17

Table 18: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 19: Configuration Register (Address: 0x01) 15 ...

Page 18

Table 20: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...

Page 19

Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 21: Hysteresis Applied to Alarm ...

Page 20

Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...

Page 21

Table 25: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 26: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...

Page 22

... TYP 2.504 (63.6) TYP Back view U9 U10 U11 4.2 (0.165) TYP 47.4 (1.87) TYP additional design dimensions. times occur. 22 Module Dimensions U6 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP 0.6 (0.024) Pin 199 TYP U12 10.0 (0.394) TYP Pin 2 11.4 (0.45) TYP 16 ...

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