MT29F1G16ABBDAHC:D Micron Technology Inc, MT29F1G16ABBDAHC:D Datasheet

MT29F1G16ABBDAHC:D

Manufacturer Part Number

MT29F1G16ABBDAHC:D

Description

Manufacturer

Micron Technology Inc

Datasheet

1.MT29F1G16ABBDAHCD.pdf (1 pages)

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

MT29F1G16ABBDAHC:D

Manufacturer:

Micron Technology Inc

Quantity:

10 000

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Micron's part numbering system is available at www.micron.com/numbering

Standard NAND Flash Part Numbering System

Micron and the Micron logo are trademarks of Micron Technology, Inc.

Products and specifications are subject to change without notice.

Dates are estimates only.

Micron Technology

Single-Supply Flash

29F = NAND Flash

29H = High Speed NAND

Density

1G = 1Gb

2G = 2Gb

4G = 4Gb

8G = 8Gb

16G = 16Gb

32G = 32Gb

64G = 64Gb

128G = 128Gb

256G = 256Gb

Device Width

08 = 8 bits

16 = 16 bits

Classification

Operating Voltage Range

A = 3.3V (2.70–3.60V), VccQ 3.3V (2.70–3.60V)

B = 1.8V (1.70–1.95V)

C = 3.3V (2.70–3.60V), VccQ 1.8V (1.70–1.95V)

*Contact Micron for help differentiating between standard and next-generation NAND offerings.

Rev. 2/26/2009

Standard NAND Flash*

Mark

Bit/cell

MLC

SLC

4 + 4

Die

2 + 2

nCE

29F

2 + 2

RnB

I/O Channels

WP - xx

xx xx xx ES : A

A = 1st design revision

Blank = Production

ES = Engineering samples

QS = Qualification samples

MS = Mechanical samples

Blank = Commercial (0°C to +70°C)

ET = Extended (–40°C to +85°C)

WT = Wireless (–25°C to +85°C)

Blank = Standard device

Blank = Full specification

15 = 133 MT/s

12 = 166 MT/s

WP = 48-pin TSOP I (CPL version) (Pb-free)

WC = 48-pin TSOP I (OCPL version) (Pb-free)

H1 = 100-ball VFBGA (Pb-free), 12 x 18 x 1.0

H2 = 100-ball TFBGA (Pb-free), 12 x 18 x 1.2

HC = 63-ball VFBGA, 10.5 x 13 x 1.0

C2 = 52-pad ULGA, 12 x 17 x 0.4 (use TBD)

C3 = 52-pad ULGA, 12 x 17 x 0.65

C4 = 52-pad VLGA, 12 x 17 x 1.0 (SDP/DDP/QDP)

C5 = 52-pad VLGA, 14 x 18 x 1.0 (SDP/DDP/QDP)

C6 = 52-pad LLGA, 14 x 18 x 1.47 (8DP, QDP, DDP)

C7 = 48-pad LLGA, 12 x 20 x 1.47 (8DP)

SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free)

SWP = 48-pin Stacked TSOP (CPL version) (Pb-free)

A = 1st set of device features

B = 2nd set of device features (rev only if different than 1st set)

C = 3rd set of device features (rev only if different)

D = 4th set of device features (rev only if different)

etc.

Design Revision (shrink)

Production Status

Operating Temperature Range

Block Option (Reserved for use)

Flash Performance

Speed Grade (MT29H Only)

Package Code

Generation (M29 only)/Feature Set

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