E28F004B5T80 Intel, E28F004B5T80 Datasheet - Page 7

no-image

E28F004B5T80

Manufacturer Part Number
E28F004B5T80
Description
Manufacturer
Intel
Datasheet

Specifications of E28F004B5T80

Density
4Mb
Access Time (max)
80ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
5V
Operating Temp Range
0C to 70C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
512K
Supply Current
65mA
Mounting
Surface Mount
Pin Count
40
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
E28F004B5T80
Manufacturer:
INTEL
Quantity:
514
Part Number:
E28F004B5T80
Manufacturer:
INTEL
Quantity:
1 000
Part Number:
E28F004B5T80
Manufacturer:
INTEL
Quantity:
1 000
Part Number:
E28F004B5T80
Manufacturer:
INTEL
Quantity:
20 000
Part Number:
E28F004B5T80
Quantity:
600
A
A
DQ
DQ
CE#
OE#
WE#
RP#
0
9
Symbol
–A
PRELIMINARY
0
8
–DQ
–DQ
18
7
15
OUTPUT
OUTPUT
INPUT/
INPUT/
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
Type
ADDRESS INPUTS for memory addresses. Addresses are internally latched
during a write cycle.
ADDRESS INPUT: When A
this mode, A
is at a logic low, only the lower byte of the signatures are read. DQ
don’t care in the signature mode when BYTE# is low.
DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and WE# cycle
during a Program command. Inputs commands to the Command User Interface
when CE# and WE# are active. Data is internally latched during the write cycle.
Outputs array, intelligent identifier and status register data. The data pins float to
tri-state when the chip is de-selected or the outputs are disabled.
DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and WE# cycle
during a Program command. Data is internally latched during the write cycle.
Outputs array data. The data pins float to tri-state when the chip is de-selected or
the outputs are disabled as in the byte-wide mode (BYTE# = “0”). In the byte-wide
mode DQ
Not applicable to 28F004B5.
CHIP ENABLE: Activates the device’s control logic, input buffers, decoders and
sense amplifiers. CE# is active low. CE# high de-selects the memory device and
reduces power consumption to standby levels. If CE# and RP# are high, but not
at a CMOS high level, the standby current will increase due to current flow
through the CE# and RP# input stages.
OUTPUT ENABLE: Enables the device’s outputs through the data buffers during
a read cycle. OE# is active low.
WRITE ENABLE: Controls writes to the command register and array blocks. WE#
is active low. Addresses and data are latched on the rising edge of the WE#
pulse.
RESET/DEEP POWER-DOWN: Uses three voltage levels (V
control two different functions: reset/deep power-down mode and boot block
unlocking. It is backwards-compatible with the BX/BL/BV products.
When RP# is at logic low, the device is in reset/deep power-down mode,
which puts the outputs at High-Z, resets the Write State Machine, and draws
minimum current.
When RP# is at logic high, the device is in standard operation. When RP#
transitions from logic-low to logic-high, the device defaults to the read array mode.
When RP# is at V
erased. This overrides any control from the WP# input.
28F200: A[0–16], 28F400: A[0–17], 28F800: A[0–18], 28F004: A[0–18]
15
/A
0
–1
Table 2. Pin Descriptions
decodes between the manufacturer and device IDs. When BYTE#
becomes the lowest order address for data output on DQ
HH
, the boot block is unlocked and can be programmed or
9
is at V
Name and Function
HH
the signature mode is accessed. During
28F200B5, 28F004/400B5, 28F800B5
IL
, V
IH
15
, and V
/A
–1
is a
0
–DQ
HH
) to
7
.
7

Related parts for E28F004B5T80