TE28F128J3D75 Micron Technology Inc, TE28F128J3D75 Datasheet - Page 14

• Manufacturer Part Number: TE28F128J3D75
• Manufacturer: Micron Technology Inc

Specifications of TE28F128J3D75

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 75ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 24/23Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 16M/8M
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

Table 2:
Notes:
1.
2.
Datasheet
14
Package Body Thickness (256- Mbit)
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D (32/64/128
Mb)
Corner to Ball A1 Distance Along E (32/64/128
Mb)
For Daisy Chain Evaluation Unit information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
For Packaging Shipping Media information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
Easy BGA Package Dimensions Table (Sheet 2 of 2)
Parameter
b
D
E
[e]
N
Y
S1
S2
A2
Symb
ol
0.330
9.900
12.900
1.400
2.900
Min
1.000
0.910
0.430
10.000
13.000
64
1.500
3.000
Nom
Millimeters
Numonyx™ Embedded Flash Memory (J3 v. D)
0.530
10.100
13.100
0.100
1.600
3.100
Max
1
1
1
1
Note
s
0.0130
0.3898
0.5079
0.0551
0.1142
Min
0.0358
0.0169
0.3937
0.5118
0.0394
64
0.0591
0.1181
Inches
Nom
November 2007
308551-05
0.0039
0.0209
0.3976
0.5157
0.0630
0.1220
Max