DT28F160F3T95 Intel, DT28F160F3T95 Datasheet

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DT28F160F3T95

Manufacturer Part Number
DT28F160F3T95
Description
Manufacturer
Intel
Datasheet

Specifications of DT28F160F3T95

Density
16Mb
Access Time (max)
95ns
Interface Type
Parallel
Boot Type
Top
Address Bus
20b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
SSOP
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
1M
Supply Current
60mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant

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DT28F160F3T95
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INTEL
Quantity:
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3 Volt Fast Boot Block Flash Memory
28F800F3—Automotive
Product Features
The Intel
making it an ideal memory solution for burst CPUs. The Intel 3 Volt Fast Boot Block Flash memory also
supports asynchronous page mode operation for non-clocked memory subsystems. Combining high read
performance with the intrinsic nonvolatility of flash memory eliminates the traditional redundant memory
paradigm of shadowing code from a slower nonvolatile storage source to a faster execution memory device,
(e.g., SRAM SDRAM), for improved system performance. By adding 3 Volt Fast Boot Block Flash
memory to your system you could reduce the total memory requirement, which helps increase reliability
and reduce overall system power consumption—all while reducing system cost.
This family of products is manufactured on Intel
available in a wide variety of industry-standard packaging technologies.
Notice: This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
High Performance
SmartVoltage Technology
Enhanced Data Protection
Manufactured on ETOX™ V Flash Technology
— Up to 50 MHz Effective Zero Wait-State
— Synchronous Burst-Mode Reads
— Asynchronous Page-Mode Reads
— 3.0 V 3.6 V Read and Write Operations for
— 12 V V
— Absolute Write Protection with
— Block Locking
— Block Erase/Program Lockout during Power
Performance
Low Power Designs
V
Transitions
PP
®
3 Volt Fast Boot Block Flash memory offers the highest performance synchronous burst reads—
= GND
PP
Fast Factory Programming
®
0.4 m ETOX™ V process technology. They are
Supports Code Plus Data Storage
Flexible Blocking Architecture
Extended Cycling Capability
Low Power Consumption
Automated Program and Block Erase
Algorithms
Industry-Standard Packaging
— Optimized for Flash Data Integrator (FDI)
— Fast Program Suspend Capability
— Fast Erase Suspend Capability
— Eight 4-Kword Blocks for Data
— 32-Kword Main Blocks for Code
— Top or Bottom Boot Configurations
— Command User Interface for Automation
— Status Register for System Feedback
— 56-Lead SSOP
— Intel
and other Intel
®
Preliminary Datasheet
Easy BGA
®
Software
Order Number: 290686-003
March 2001

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DT28F160F3T95 Summary of contents

Page 1

... Volt Fast Boot Block Flash memory offers the highest performance synchronous burst reads— making it an ideal memory solution for burst CPUs. The Intel 3 Volt Fast Boot Block Flash memory also supports asynchronous page mode operation for non-clocked memory subsystems. Combining high read ...

Page 2

... Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800- 548-4725 or by visiting Intel’s website at http://www.intel.com. ...

Page 3

Contents 1.0 Introduction .................................................................................................................. 1 1.1 Product Overview .................................................................................................. 1 2.0 Product Description 2.1 Pinouts .................................................................................................................. 2 2.2 Pin Description ...................................................................................................... 2 2.3 Memory Blocking Organization ............................................................................. 5 2.3.1 Parameter Blocks ..................................................................................... 5 2.3.2 Main Blocks .............................................................................................. 5 3.0 Principles ...

Page 4

Standby Power.................................................................................................... 25 7.4 Power-Up/Down Operation ................................................................................. 26 7.4.1 RST# Connection................................................................................... 26 7.4.2 VCC, VPP and RST# Transitions........................................................... 26 7.5 Power Supply Decoupling ................................................................................... 26 7.5.1 VPP Trace on Printed Circuit Boards ..................................................... 27 8.0 Electrical Specifications 8.1 ...

Page 5

Revision History Date of Version Revision 10/01/99 -001 08/03/00 -002 03/26/01 -003 PRELIMINARY Description Original version Removed all references and 1.65 V I/O capability. Removed -125 ns device and added 80ns device. Changed t time from 19 ...

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...

Page 7

... Introduction This datasheet contains 8-Mbit 3 Volt Intel 1.0 provides a flash memory overview. Sections 2.0 through 8.0 describe the memory functionality and electrical specifications for automotive temperature product offerings. 1.1 Product Overview The 3 Volt Fast Boot Block Flash memory provides density upgrades with pinout compatibility for 8-Mbit densities ...

Page 8

... This section describes the pinout and block architecture of the device family. 2.1 Pinouts Intel 3 Volt Fast Boot Block Flash memory provides upgrade paths in each package pinout up to the 8-Mbit density. The family is available in Easy BGA and 56-lead SSOP packages. Ballout for the Easy BGA is illustrated in ...

Page 9

... All locations are populated with solder balls. 2. Shaded connections on the Top View indicate possible future upgrade address connections. 3. Reference the Preliminary Mechanical Specification for Easy BGA Package at the Intel® Flash Packaging Data website, http://developer.intel.com/design/flash/packdata/index.htm, for detailed package specifications. ...

Page 10

... DQ OUTPUT 15 when the chip is deselected or outputs are disabled. Data is internally latched during a write cycle. CLOCK: Synchronizes the flash memory to the system operating frequency during synchronous burst mode read operations. When configured for synchronous burst-mode reads, the address is latched on CLK INPUT the first rising (or falling, depending upon the read configuration register setting) CLK edge when ADV# is active or upon a rising ADV# edge, whichever occurs first ...

Page 11

... Memory Blocking Organization The 3 Volt Fast Boot Block Flash memory family is an asymmetrically-blocked architecture that enables system integration of code and data within a single flash device. For the address locations of each block, see the memory maps in Map” on page 6. 8-Mbit Top Boot and Bottom Boot Blocking. ...

Page 12

Figure 3. 8- Mbit Top Boot and Bottom Boot Memory Map 8-Mbit 4-KWord Parameter Block 22 4-KWord Parameter Block 21 4-KWord Parameter Block 20 4-KWord Parameter Block 19 4-KWord Parameter Block 18 4-KWord Parameter Block 17 4-KWord Parameter Block ...

Page 13

... It allows for CMOS-level control inputs, fixed power supplies, and minimal processor overhead with RAM-like interface timings. 3.1 Bus Operations The local CPU reads and writes flash memory in-system. All flash memory read and write cycles conform to standard microprocessor bus cycles. 3.1.1 Read The flash memory has three read modes available: read array, identifier codes, and status register ...

Page 14

Standby Deselecting the device by bringing CE logic-high level (V mode, which substantially reduces device power consumption. In standby, outputs are placed in a high-impedance state independent of OE#. If deselected during program or erase operation, ...

Page 15

... Block Erase and Program Suspend Block Erase and Program Resume Set Read Configuration NOTES: 1. Commands other than those shown above are reserved by Intel for future device implementations and should not be used. 2. Bus operations are defined Any valid address within the device. ...

Page 16

SRD = Data read from status register. See of the status register bits Data to be written at location WA. Data is latched on the rising edge of WE# or CE# (whichever goes high first). ID ...

Page 17

CLK edge when ADV# is low during synchronous burst mode or the falling edge of OE# or CE#, whichever occurs first. The Read Status Register command functions independently of the V voltage. 4.4 Clear Status Register Command Status register bits ...

Page 18

Table 5. Status Register Definition WSMS ESS SR.7 = WRITE STATE MACHINE STATUS (WSMS Ready 0 = Busy SR.6 = ERASE SUSPEND STATUS (ESS Block Erase Suspended 0 = Block Erase ...

Page 19

... Program Suspend/Resume Command The Program Suspend command allows program interruption to read data in other flash memory locations. Once the program process starts, writing the Program Suspend command requests that the WSM suspend the program operation after a certain latency period. The device continues to output status register data when read after issuing the Program Suspend command ...

Page 20

... These bits are reserved for future use. Set these bits to “0.” Undocumented combinations of bits RCR.10–9 are reserved by Intel Corporation for future implementations and should not be used. In the asynchronous page mode, the burst length always equals four words. Undocumented combinations of bits RCR.2– ...

Page 21

... The frequency configuration codes in Table 7 are derived from equations (1), (2) and (3) with assumed values for the t calculation to obtain the frequency configuration code: Flash performance can be determined by the following equations: {1/Frequency (MHz)} = CLK Period (ns) n(CLK Period) t n-2 = Frequency Configuration Code (FCC) ...

Page 22

Figure 4. Data Output with FCC Setting at Code 3 CLK (C) CE# ADV 15-0 NOTE: 1. Figure 4 shows the data output available and valid after 4 latencies from ADV# going low in the 1st clock ...

Page 23

Table 7. Frequency Configuration Settings Frequency Configuration Code NOTE: Table derived by using formulas (1), (2) and (3) in assumed and 4 ns respectively; value of t 4.9.3 Data Output ...

Page 24

... Burst Sequence – (RCR.7) The burst sequence specifies the order in which data is addressed in synchronous burst mode. This order is programmable as either linear or Intel burst order. The continuous burst length only supports linear burst order. The order chosen will depend on the CPU characteristic. See for more details ...

Page 25

... Continuous Burst Length When operating in the continuous burst mode, the flash memory may incur an output delay when the burst sequence crosses the first 16-word boundary. The starting address dictates whether or not a delay will occur. If the starting address is aligned to a four-word boundary, the delay will not be seen. If the starting address is the end of a four-word boundary, the output delay will be equal to the frequency configuration setting ...

Page 26

Figure 7. Automated Block Erase Flowchart Start Write 20H, Block Address Write D0H, Block Address Read Status Register SR Full Status Check if Desired Block Erase Complete FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) ...

Page 27

Figure 8. Automated Program Flowchart Start Write 40H, Address Write Data and Address Read Status Register SR Full Status Check if Desired Program Complete FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) SR SR.1 ...

Page 28

Figure 9. Block Erase Suspend/Resume Flowchart Start Write B0H Read Status Register SR.7 = SR.6 = Read Read or Byte Write? Read Array Data Done Write D0H Block Erase Resumed 22 Bus Operation Standby Standby Block ...

Page 29

Figure 10. Program Suspend/Resume Flowchart Start Write B0H Read Status Register SR SR Write FFH Read Array Data Done Reading Yes Write D0H Program Resumed PRELIMINARY Bus Operation Write Read Standby 0 Standby Write 0 Program ...

Page 30

... Data Protection The 3 Volt Fast Boot Block Flash memory architecture features two hardware-lockable parameter blocks, so critical code can be kept secure while six other parameter blocks can be programmed or erased as necessary to facilitate EEPROM emulation. 5 PPLK The V programming voltage can be held low for complete write protection of all blocks in the PP flash device ...

Page 31

... V Voltages PP Intel 3 Volt Fast Boot Block Flash memory provides in-system programming and erase at 3.0 V– 3.6 V. For customers requiring fast programming in their manufacturing environment, this family of products includes an additional high-performance 12 V programming feature. The mode enhances programming performance during short period of time typically PP found in manufacturing processes ...

Page 32

... If a CPU reset occurs without a flash memory reset, proper CPU initialization will not occur because the flash memory may be providing status information instead of array data. Intel recommends connecting RST# to the system reset signal to allow proper CPU/flash initialization following system reset. ...

Page 33

... Transient current magnitudes depend on the device outputs’ capacitive and inductive loading. Two- line control and proper de-coupling capacitor selection will suppress these transient voltage peaks. Each flash device should have a 0.1 µF ceramic capacitor connected between each V and between its placed as close as possible to the package leads ...

Page 34

... V connected for a total of 80 hours maximum. NOTICE: This datasheet contains preliminary information on new products in production. The specifications are subject to change without notice. Verify with your local Intel Sales office that you have the latest datasheet before . finalizing a design Warning: Stressing the device beyond the “ ...

Page 35

Automotive Temperature Operating Conditions Symbol T Operating Temperature Supply Voltage CC1 CC V I/O Voltage CCQ Supply Voltage PP1 Supply Voltage PP2 PP Parameter Block Erase Cycling Cycling Main Block ...

Page 36

DC Characteristics—Automotive Temperature Sym Parameter I V Standby Current CCS Read Current CCR Program Current CCW Block Erase Current CCE Program Current PPW ...

Page 37

Figure 11. AC Input/Output Reference Waveform for V V CCQ 0V NOTE: AC test inputs are driven at 3.0 V for a Logic "1" and 0.0 V for a Logic "0." Input timing begins, and output timing ends ...

Page 38

AC Characteristics—Read-Only Operations Automotive Temperature # Symbol Parameter R1 t CLK Period CLK CLK High (Low) Time CLK Fall (Rise) Time CHCL R4 t Address Valid Setup to CLK AVCH ...

Page 39

Figure 13. AC Waveform for CLK Input Figure 14. AC Waveform for Single Asynchronous Read Operations from Parameter Blocks, Status Register, Identifier Codes (A) 19 ADV# ( CE# (E) ...

Page 40

Figure 15. AC Waveform for Asynchronous Page Mode Read Operations from Main Blocks (A) 19 (A) 1 ADV# ( CE# ( ...

Page 41

Figure 16. AC Waveform for Single Synchronous Read Operations from Parameter Blocks, Status Register, Identifier Codes V IH CLK [ [A] 19 R17 V IH ADV# [ CE# [E] ...

Page 42

Figure 17. AC Waveform for Synchronous Burst Read Operations, Four-Word Burst Length, from Main Blocks V IH CLK ( (A) 19 ADV# ( CE# (E) V ...

Page 43

Figure 18. AC Waveform for Continuous Burst Read, Showing an Output Delay with Data Output Configuration Set to One Clock CLK (C) A (A) 19-0 ADV# (V) CE# (E) OE# (G) WE# (W) WAIT# (T) DQ (D/Q) 15-0 NOTES: 1. ...

Page 44

AC Characteristics—Write Operations Temperature # Sym RST# High Recovery to WE# (CE#) Going Low PHWL PHEL CE# (WE#) Setup to WE# (CE#) Going Low ELWL WLEL ...

Page 45

Figure 20. AC Waveform for Write Operations Note (A) 20 ADV# ( CE# (WE#) [E(W OE# [ WE# (CE#) [W(E)] ...

Page 46

AC Characteristics—Reset Operation—Automotive Temperature Figure 21. AC Waveform for Reset Operation RST ( (A) Reset while device is in read mode RST # (B) Reset during program or block ...

Page 47

Automotive Temperature Block Erase and Program Performance # Sym Program Time Block Program Time (Parameter) WHRH EHRH1 Block Program Time (Main) W19 Block Erase Time (Parameter WHRH EHRH2 Block Erase Time (Main) t ...

Page 48

... Ordering Information Package DE = Automotive temp., 56-Lead SSOP RA = Automotive temp., 56-Ball Easy BGA Product line designator ® for all Intel Flash products Device Density 800 = x16 (8-Mbit) Valid Combinations 56-Lead SSOP DE28F800F3T80 DE28F800F3B80 DE28F800F3T95 DE28F800F3B95 42 Access Speed (ns) (80,95 Top Blocking ...

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