TXC-04252AIPQ Transwitch Corporation, TXC-04252AIPQ Datasheet - Page 139

• Manufacturer Part Number: TXC-04252AIPQ
• Manufacturer: Transwitch Corporation

Specifications of TXC-04252AIPQ

• Pin Count: 160
• Screening Level: Industrial
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

The other is a 208-lead plastic ball grid array package (PBGA) suitable for surface mounting, as illustrated in
Figure 29.
A3
Notes:
D
1. All dimensions are in millimeters. Values shown are for
2. Identification of the solder ball A1 corner is contained
3. Size of array: 16 x 16, JEDEC code MO-151-AAF-1
D2
A2
reference only.
within this shaded zone. This package corner may be
a 90° angle, or chamfered for A1 identification.
Proprietary TranSwitch Corporation Information for use Solely by its Customers.
Figure 29. QE1M TXC-04252 208-Lead Plastic Ball Grid Array Package
E1/4
TRANSWITCH
TXC-04252AIOG
Note 2
D1/4
E2
E
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DATA SHEET
A
A1
Dimension (Note 1)
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
D1 (BSC)
E1 (BSC)
A3 (Ref.)
e (BSC)
T R P N M L K J H G F E D C B
D2
A1
A2
E2
D
A
E
b
e
Bottom View
-E1-
15.00
15.00
1.35
0.30
0.75
0.40
Min
17.00
15.00
17.00
15.00
Ed. 3, December 2000
0.36
1.00
TXC-04252
b
TXC-04252-MB
15.70
15.70
A
Max
1.75
0.50
0.85
0.60
QE1M
-D1-