MT45W2MW16PGA-70 ITTR Micron Technology Inc, MT45W2MW16PGA-70 ITTR Datasheet - Page 26

• Manufacturer Part Number: MT45W2MW16PGA-70 ITTR
• Manufacturer: Micron Technology Inc

Specifications of MT45W2MW16PGA-70 ITTR

• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 24:
PDF: 09005aef82832fa7 / Source: 09005aef82832f97
32mb_asyncpage_cr1_0_p24z_2.fm - Rev. B 12/09 EN
and temperature range for production devices. Although considered final, these specifications are subject to change, as fur-
their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply
Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
SEATING
PLANE
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
0.10 A
5.25
48X Ø0.37
48-Ball VFBGA
BALL A6
2.625
0.70 ±0.05
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
ther product development and data characterization sometimes occur.
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W2MW16PGA uses “green” packaging.
1.875
0.25mm per side.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
32Mb: 2 Meg x 16 Async/Page CellularRAM 1.0 Memory
0.75 TYP
C L
4.00 ±0.05
BALL A1
BALL A1 ID
26
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
BALL A1 ID