BF5030E6327XT Infineon Technologies, BF5030E6327XT Datasheet
BF5030E6327XT
Specifications of BF5030E6327XT
Related parts for BF5030E6327XT
BF5030E6327XT Summary of contents
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Silicon N-Channel MOSFET Tetrode • Designed for input stages of UHF- and VHF-tuners with AGC function • Supporting 5 V operations and power saving 3 V operations • Integrated ESD gate protection diodes • Very low noise figure • High ...
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Maximum Ratings Parameter Drain-source voltage Continuous drain current Gate 1/ gate 2-source current Gate 1/ gate 2-source voltage Total power dissipation ≤ 94 °C, BF5030W T S ≤ 76 °C, BF5030, BF5030R T S Storage temperature Channel temperature Thermal Resistance ...
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Electrical Characteristics at T Parameter DC Characteristics Drain-source breakdown voltage µ G1S G2S Gate1-source breakdown voltage + mA G1S G2S Gate2-source breakdown voltage +I ...
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Electrical Characteristics at T Parameter AC Characteristics - (verified by random sampling) Forward transconductance mA G2S mA G2S Gate1 input ...
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Total power dissipation P BF5030W 220 mA 180 160 140 120 100 ƒ(I Drain current ...
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Gate 1 current I G1 G1S V = Parameter G2S … 200 µA 100 0.5 1 1.5 = ƒ(V Drain current I D G1S ...
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Drain current Parameter in kΩ G1 … ...
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Power gain G ps G2S G2S … G2S ...
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Crossmodulation test circuit R GEN 50Ω AGC DS 4n7 R1 10kΩ 2.2 uH 4n7 4n7 50 Ω RG1 BF5030... 4n7 RL 50Ω Semibiased 2009-05-05 ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT143 2.9 ±0 0.2 +0.1 0.8 -0.05 +0.1 0.4 -0.05 0.25 B ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT143R 2.9 ±0 0.2 +0.1 0.8 -0.05 +0.1 0.4 -0.05 1.7 0.2 ...
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Package Outline +0.1 0.3 -0.05 4x 0.1 Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT343 2 ±0.2 0.1 MAX. 1.3 0 0.15 1 ...
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... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...