HYB3165800J-60 Infineon Technologies AG, HYB3165800J-60 Datasheet

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HYB3165800J-60

Manufacturer Part Number
HYB3165800J-60
Description
8M x 8bit DRAM
Manufacturer
Infineon Technologies AG
Datasheet
(4k & 8k Refresh)
8M x 8-Bit Dynamic RAM
Preliminary Information
Semiconductor Group
8 388 608 words by 8-bit organization
0 to 70 ˚C operating temperature
Fast access and cycle time
RAS access time:
50 ns (-50 version)
60 ns (-60 version)
Cycle time:
90 ns (-50 version)
110 ns (-60 version)
CAS access time:
13 ns ( -50 version)
15 ns ( -60 version)
Fast page mode cycle time
35 ns (-50 version)
40 ns (-60 version)
Single + 3.3 V ( 0.3V) power supply
Low power dissipation
max. 396 active mW ( HYB 3164800J/T-50)
max. 360 active mW ( HYB 3164800J/T-60)
max. 504 active mW ( HYB 3165800J/T-50)
max. 432 active mW ( HYB 3165800J/T-60)
7.2 mW standby (TTL)
720 W standby (MOS)
Read, write, read-modify-write, CAS-before-RAS refresh (CBR),
RAS-only refresh, hidden refresh and self refresh modes
Fast page mode capability
8192 refresh cycles/128 ms , 13 R/ 10C addresses (HYB 3164800J/T)
4096 refresh cycles/ 64 ms , 12 R/ 11C addresses (HYB 3165800J/T)
Plastic Package:
P-SOJ-34-1
P-TSOPII-34-1 500 mil
500 mil
121
HYB 3164(5)800T
HYB 3164(5)800J
HYB 3164800J/T -50/-60
HYB 3165800J/T -50/-60

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HYB3165800J-60 Summary of contents

Page 1

Dynamic RAM (4k & 8k Refresh) Preliminary Information 8 388 608 words by 8-bit organization • ˚C operating temperature • Fast access and cycle time • RAS access time (-50 version) 60 ...

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This device MBit dynamic RAM organized 8 388 608 by 8 bits. The device is fabricated in SIEMENS/IBM’s most advanced first generation 64Mbit CMOS silicon gate process technology. The circuit and process design allow this device to ...

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Pin Configuration Semiconductor Group HYB 3164(5)800J/T-50/-60 P-SOJ-34-1 (500 mil) P-TSOPII-34-1 (500 mil) 123 8M x 8-DRAM ...

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TRUTH TABLE FUNCTION Standby Read Early-Write Delayed-Write Read-Modify-Write Fast Page Mode Read 1st Cycle 2nd Cycle Fast Page Mode Early 1st Cycle Write 2nd Cycle Fast Page Mode RMW 1st Cycle 2st Cycle RAS only refresh CAS-before-RAS refresh Test Mode ...

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Block Diagram for HYB 3165800J/T Semiconductor Group HYB 3164(5)800J/T-50/-60 125 8M x 8-DRAM ...

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Block Diagram for HYB 3164800J/T Semiconductor Group HYB 3164(5)800J/T-50/-60 126 8M x 8-DRAM ...

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Absolute Maximum Ratings Operating temperature range.............................................................................................. ˚C Storage temperature range.........................................................................................– 150 ˚C Input/output voltage..................................................................................-0.5 to min (Vcc+0.5,4.6) V Power supply voltage....................................................................................................-0.5V to 4.6 V Power dissipation......................................................................................................................1.0 W Data out current (short circuit)..................................................................................................50 mA Note Stresses above ...

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DC Characteristics (cont’ ˚ Parameter Average Vcc supply current, during RAS-only refresh cycles: (RAS cycling: CAS = VIH: tRC = tRC min.) Average Vcc supply current, during fast ...

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AC Characteristics (note: 6,7, ˚C, = 3.3 0. Parameter common parameters Random read or write cycle time RAS precharge time RAS pulse width CAS pulse width Row address setup time Row address ...

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AC Characteristics (cont’ ˚C, = 3.3 0. Parameter CAS to output in low-Z Output buffer turn-off delay Output buffer turn-off delay from OE Data to OE low delay CAS high to data ...

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AC Characteristics (cont’ ˚C, = 3.3 0. Parameter CAS precharge to RAS Delay Fast Page Mode Read-Modify-Write Cycle Fast page mode read-write cycle time CAS precharge to WE CAS-before-RAS refresh cycle CAS ...

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Notes: 1) All voltages are referenced to VSS. 2) ICC1, ICC3, ICC4 and ICC6 and ICC7 depend on cycle rate. 3) ICC1 and ICC4 depend on output loading. Specified values are measured with the output open. 4) Address can be ...

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V IH RAS CAS ASR V IH Row Address Address WRITE I/O1-I/O4 8 (Inputs I/O1-I/O8 (Outpus) ...

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V IH RAS CAS ASR V IH Row Address Address WRITE I/O1-I/O8 (Inputs I/O1-I/O8 (Outputs) V ...

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V IH RAS CAS ASR V IH Row Address Address WRITE I/O1-I/O8 (Inputs I/O1-I/O8 (Outputs) V ...

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V IH RAS CAS t ASR V IH Address Row Address WRITE I/O1-I/O8 (Inputs I/O1-I/O8 (Outputs) V ...

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Fast Page Mode Read-Modify-Write Cycle Semiconductor Group HYB 3164(5)800J/T-50/-60 137 8M x 8-DRAM ...

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V IH RAS CAS RAH t ASR V IH Row Address Addr RAD t RCS V IH WRITE I/O1-I/O8 IH (Inputs) V ...

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V IH RAS CAS RAH t ASR V IH Row Address Addr RAD V IH WRITE I/O1-I/O8 (Inputs ...

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V IH RAS CAS ASR V IH Address I/O1-I/O8 (Outputs “H” or “L” RAS-Only Refresh Cycle Semiconductor Group t RAS t RAH Row Address HI-Z 140 HYB ...

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V IH RAS RPC CAS WRITE OEZ CDD V IH I/O1-I/O8 (Inputs ODD V OH I/O1-I/O8 ...

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V IH RAS CAS RAD t RAH t ASR V IH Row Address Addr WRITE I/O1-I/O8 (Inputs ...

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V IH RAS CAS RAH t ASR V IH Row Address Addr WRITE I/O1-I/O8 (Inputs ...

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V IH RAS CAS Address V IL Read Cycle V IH WRITE I/O1-I/O8 IH (Inputs I/O1-I/O8 OH (Outputs Write ...

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V IH RAS CAS Adress WRITE ODD V I/O1-I/O8 IH (Inputs CDD t OEZ V OH I/O1-I/O8 ...

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V IH RAS RPC CAS WRITE OEZ CDD V IH I/O1-I/O8 (Inputs ODD V OH I/O1-I/O8 ...

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Package Outlines P-SOJ-34-1 (500 mil) (Plastic Small Outline J-leaded Package) Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. SMD = Surface Mounted Device Semiconductor Group HYB 3164(5)800J/T-50/-60 147 8M x 8-DRAM ...

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P-TSOPII-34-1 (500 mil) (Plastic Thin Small Outline Package Type Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. SMD = Surface Mounted Device Semiconductor Group HYB 3164(5)800J/T-50/-60 148 8M x 8-DRAM Dimensions ...

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