LM4867MTEX/NOPB National Semiconductor, LM4867MTEX/NOPB Datasheet
LM4867MTEX/NOPB
Specifications of LM4867MTEX/NOPB
Related parts for LM4867MTEX/NOPB
LM4867MTEX/NOPB Summary of contents
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... Note 2: An LM4867LQ or LM4867MTE that has been properly mounted to a circuit board and forced-air cooled will deliver 2.4W into 3Ω. Connection Diagrams See NS Package Number MXA20A for Exposed-DAP TSSOP Boomer ® registered trademark of National Semiconductor Corporation. © 2004 National Semiconductor Corporation Key Specifications THD+N O LM4867LQ, 3Ω ...
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Connection Diagrams See NS Package Number LQA24A for Exposed-DAP LLP Typical Application * Refer to the Application Information section titled PROPER SELECTION OF EXTERNAL COMPONENTS for details concerning the value of C FIGURE 1. Typical Audio Amplifier Application Circuit (Pin ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 4) ESD Susceptibility (Note 5) All pins except Pin 3 (MT, MTE), Pin 2 (LQ) Pin 3 (MT, MTE), Pin 2 (LQ) ...
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Electrical Characteristics for Bridged-Mode Operation The following specifications apply for V Symbol Parameter THD+N Total Harmonic Distortion+Noise PSRR Power Supply Rejection Ratio X Channel Separation TALK SNR Signal To Noise Ratio Electrical Characteristics for Single-Ended Operation The following specifications apply ...
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Typical Performance Characteristics MTE- and LQ- Specific Characteristics LM4867MTE THD+N vs Output Power LM4867LQ THD+N vs Output Power LM4867MTE THD+N vs Output Power 20001333 20001353 20001336 5 LM4867MTE THD+N vs Frequency 20001334 LM4867LQ THD+N vs Frequency 20001354 LM4867LQ THD+N vs ...
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Typical Performance Characteristics MTE- and LQ- Specific Characteristics LM4867LQ, LM4867MTE Power Dissipation vs Power Output LM4867LQ Power Derating Curve Note 18: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: ...
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Typical Performance Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power 20001303 THD+N vs Output Power 20001305 THD+N vs Output Power 20001307 7 THD+N vs Frequency 20001304 20001306 20001308 www.national.com ...
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Typical Performance Characteristics THD+N vs Output Power THD+N vs Output Power Output Power vs Load Resistance www.national.com (Continued) 20001365 20001366 20001362 8 THD+N vs Frequency 20001363 THD+N vs Frequency 20001364 Power Dissipation vs Supply Voltage 20001360 ...
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Typical Performance Characteristics Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Load Resistance (Continued) 20001309 20001311 20001313 9 Output Power vs Supply Voltage 20001310 Output Power vs Load Resistance 20001312 Power Dissipation vs Output Power ...
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Typical Performance Characteristics Dropout Voltage vs Supply Voltage Power Dissipation vs Output Power Channel Separation www.national.com (Continued) 20001315 20001317 20001319 10 Power Derating Curve 20001316 Noise Floor 20001318 Channel Separation 20001320 ...
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Typical Performance Characteristics Power Supply Rejection Ratio Supply Current vs Supply Voltage External Components Description Figure 1 Components 1. R Inverting input resistance which sets the closed-loop gain in conjunction with R i high pass filter with ...
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Application Information applied to both headphone speaker terminals. This results in no net DC current flow through the speaker. AC current flows through a headphone speaker as an audio signal’s output amplitude increases on the speaker’s terminal. When operating as ...
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Application Information FIGURE 4. Typical Audio Amplifier Application Circuit (Pin out shown for the 24-pin Exposed-DAP LLP package. Numbers are for the 20-pin MTE and MT packages.) STEREO-INPUT MULTIPLEXER (STEREO MUX) The LM4867 has two stereo inputs. ...
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Application Information present on the internal amplifier’s input may change. This change can slew at a rate that may produce audible voltage transients or clicks in the amplifier’s output signal. Using the MUX to select between two vastly dissimilar gains ...
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Application Information PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’s impedance. As load imped- ance decreases, load dissipation ...
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Application Information JMAX DMAX Equation (6) gives the maximum junction temperature the result violates the LM4867’s 150˚C, reduce the JMAX maximum junction temperature by reducing the power sup- ply voltage or increasing the load ...
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Application Information headphones are connected to the jack shown in Figure 8, and internal pull−up forces V on the internal comparator’s DD HP−IN inputs. This changes the comparator’s output state and enables the headphone function: it turns off Amp2B, switches ...
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Application Information (Pin numbers are for the 20-pin MTE and MT packages.) INPUT CAPACITOR VALUE SELECTION Amplifying the lowest audio frequencies requires high value input coupling capacitor (C in Figure 4). A high value capaci- i tor ...
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Application Information In order eliminate “clicks and pops“, all capacitors must be discharged before turn-on. Rapidly switching V allow the capacitors to fully discharge, which may cause “clicks and pops“. NO LOAD STABILITY The LM4867 may exhibit low level oscillation ...
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Application Information www.national.com (Continued) FIGURE 9. Recommended LQ PC Board Layout: Component-Side Silkscreen FIGURE 10. Recommended LQ PC Board Layout: Component-Side Layout 20 20001340 20001341 ...
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Application Information FIGURE 11. Recommended LQ PC Board Layout: FIGURE 12. Recommended LQ PC Board Layout: (Continued) Upper Inner-Layer Layout Lower Inner-Layer Layout 21 20001342 20001343 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 13. Recommended LQ PC Board Layout: Bottom-Side Layout FIGURE 14. Recommended MTE PC Board Layout: Component-Side Silkscreen 22 20001344 20001345 ...
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Application Information FIGURE 15. Recommended MTE PC Board Layout: FIGURE 16. Recommended MTE PC Board Layout: (Continued) Component-Side Layout Upper Inner-Layer Layout 23 20001346 20001347 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 17. Recommended MTE PC Board Layout: Lower Inner-Layer Layout FIGURE 18. Recommended MTE PC Board Layout: Bottom-Side Layout 24 20001348 20001349 ...
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Application Information FIGURE 19. Recommended MT PC Board Layout: FIGURE 20. Recommended MT PC Board Layout: (Continued) Component-Side Silkscreen Component-Side Layout 25 20001350 20001351 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 21. Recommended MT PC Board Layout: Bottom-Side Layout 26 20001352 ...
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Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead MOLDED PKG, Leadless Leadframe Package LLP 20-Lead MOLDED PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH Order Number LM4867LQ NS Package Number LQA24A Order Number LM4867MT NS Package Number MTC20 27 www.national.com ...
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... BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...