MT4LC4M16R6TG-5S Micron Semiconductor Products, MT4LC4M16R6TG-5S Datasheet

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MT4LC4M16R6TG-5S

Manufacturer Part Number
MT4LC4M16R6TG-5S
Description
4 MEG x 16 EDO DRAM, 50ns
Manufacturer
Micron Semiconductor Products
Datasheet
DRAM
FEATURES
• Single +3.3V ±0.3V power supply
• Industry-standard x16 pinout, timing, functions,
• 12 row, 10 column addresses (R6)
• High-performance CMOS silicon-gate process
• All inputs, outputs and clocks are LVTTL-compatible
• Extended Data-Out (EDO) PAGE MODE access
• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH
• Optional self refresh (S) for low-power data
OPTIONS
• Plastic Package
• Timing
• Refresh Rates
• Operating Temperature Range
NOTE: 1. The “#” symbol indicates signal is active LOW.
*Contact factory for availability.
**Available only on MT4LC4M16R6 standard refresh device.
KEY TIMING PARAMETERS
4 Meg x 16 EDO DRAM
D29_2.p65 – Rev. 5/00
SPEED
and package
13 row, 9 column addresses (N3)
distributed across 64ms
retention
50-pin TSOP (400 mil)
50ns access
60ns access
4K
8K
Standard Refresh
Self Refresh
Commercial (0°C to +70°C)
Extended (-40°C to +85°C)
-5
-6
104ns
84ns
t
RC
MT4LC4M16R6TG-5
t
50ns
60ns
RAC
Part Number Example:
20ns
25ns
t
PC
25ns
30ns
t
AA
MARKING
t
13ns
15ns
CAC
None
None
IT**
TG
N3
R6
-5
-6
S*
t
10ns
CAS
8ns
1
MT4LC4M16R6, MT4LC4M16N3
For the latest data sheet, please refer to the Micron Web
site:
4 MEG x 16 EDO DRAM PART NUMBERS
x = speed
PART NUMBER
MT4LC4M16R6TG-x
MT4LC4M16R6TG-x S
MT4LC4M16N3TG-x
MT4LC4M16N3TG-x S
A12 for N3 version, NC for R6 version.
Configuration
Refresh
Row Address
Column Addressing
www.micronsemi.com/mti/msp/html/datasheet.html
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PIN ASSIGNMENT (Top View)
RAS#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
WE#
V
V
V
V
NC
NC
NC
NC
NC
A0
A1
A2
A3
A4
A5
CC
CC
CC
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50-Pin TSOP
ADDRESSING PACKAGE REFRESH
MT4LC4M16R6 MT4LC4M16N3
4K (A0-A11)
REFRESH
4 Meg x 16
1K (A0-A9)
4K
8K
4K
8K
4K
4 MEG x 16
EDO DRAM
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
400-TSOP Standard
400-TSOP
400-TSOP Standard
400-TSOP
©2000, Micron Technology, Inc.
8K (A0-A12)
512 (A0-A8)
4 Meg x 16
V
DQ15
DQ14
DQ13
DQ12
V
DQ11
DQ10
DQ9
DQ8
NC
V
CASL#
CASH#
OE#
NC
NC
NC/A12
A11
A10
A9
A8
A7
A6
V
SS
SS
SS
SS
8K
Self
Self

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MT4LC4M16R6TG-5S Summary of contents

Page 1

... R6 † A12 for N3 version, NC for R6 version. N3 None S* Configuration Refresh None Row Address IT** Column Addressing 4 MEG x 16 EDO DRAM PART NUMBERS PART NUMBER MT4LC4M16R6TG-x MT4LC4M16R6TG MT4LC4M16N3TG-x AA CAC CAS MT4LC4M16N3TG-x S 25ns 13ns 8ns 30ns 15ns 10ns x = speed 1 4 MEG x 16 EDO DRAM www ...

Page 2

WE# CASL# CASH# NO. 2 CLOCK GENERATOR COLUMN- ADDRESS 10 BUFFER(10) REFRESH CONTROLLER A0- A11 REFRESH COUNTER ROW- 12 ADDRESS BUFFERS (12) NO. 1 CLOCK RAS# GENERATOR WE# CASL# CASH# NO. 2 CLOCK GENERATOR COLUMN- ADDRESS 9 BUFFER(9) REFRESH CONTROLLER ...

Page 3

GENERAL DESCRIPTION The 4 Meg x 16 DRAM is a high-speed CMOS, dynamic random-access memory device containing 67,108,864 bits and designed to operate from 3V to 3.6V. The device is functionally organized as 4,194,304 locations containing 16 bits each. The ...

Page 4

DRAM ACCESS (continued) the upper byte (DQ8-DQ15). General byte and word access timing is shown in Figures 1 and 2. A logic HIGH on WE# dictates read mode, while a logic LOW on WE# dictates write mode. During a WRITE ...

Page 5

V IH RAS CAS ROW COLUMN (A) ADDR IOH OPEN V IOL RAS CAS ...

Page 6

EDO PAGE MODE (continued) two methods to disable the outputs and keep them disabled during the CAS# HIGH time. The first method is to have OE# HIGH when CAS# transitions HIGH and t keep OE# HIGH for OEHC thereafter. This ...

Page 7

ABSOLUTE MAXIMUM RATINGS* Voltage on V Relative to V ................ -1V to +4. Voltage on NC, Inputs or I/O Pins Relative to V ....................................... -1V to +4.6V SS Operating Temperature, T (ambient) A Commercial ......................................... 0°C to +70°C ...

Page 8

Icc OPERATING CONDITIONS AND MAXIMUM LIMITS (Notes +3.3V ±0.3V) CC PARAMETER/CONDITION STANDBY CURRENT: TTL (RAS# = CAS STANDBY CURRENT: CMOS (RAS# = CAS 0.2V; DQs may be ...

Page 9

CAPACITANCE (Note: 2) PARAMETER Input Capacitance: Address pins Input Capacitance: RAS#, CAS#, WE#, OE# Input/Output Capacitance ELECTRICAL CHARACTERISTICS (Notes 10, 11, 12 CHARACTERISTICS PARAMETER Access time from column address Column-address setup ...

Page 10

AC ELECTRICAL CHARACTERISTICS (Notes 10, 11, 12 CHARACTERISTICS PARAMETER EDO-PAGE-MODE READ or WRITE cycle time EDO-PAGE-MODE READ-WRITE cycle time Access time from RAS# RAS# to column-address delay time Row address hold time RAS# ...

Page 11

NOTES 1. All voltages referenced This parameter is sampled. V MHz 25° dependent on output loading and cycle CC rates. Specified values are obtained with mini- mum cycle time and ...

Page 12

NOTES (continued) 28. Output parameter (DQx) is referenced to corresponding CAS# input; DQ0-DQ7 by CASL# and DQ8-DQ15 by CASH#. 29. Each CASx# must meet minimum pulse width. 30. The last CASx# edge to transition HIGH. 31. Last falling CASx# edge ...

Page 13

V IH RAS CRP V CAS ASR V IH ROW ADDR WE OE TIMING PARAMETERS -5 SYMBOL MIN ...

Page 14

V IH RAS CRP CAS ASR V IH ADDR ROW IOH DQ V IOL TIMING PARAMETERS -5 SYMBOL MIN ...

Page 15

WRITE and READ-MODIFY-WRITE cycles RAS CRP V IH CAS ASR V IH ADDR ROW WE IOH DQ V IOL ...

Page 16

V IH RAS CSH t CRP V CAS RAD t ASR t RAH V IH ADDR ROW WE OPEN OE# ...

Page 17

EDO-PAGE-MODE EARLY WRITE CYCLE V IH RAS CSH t CRP V IH CAS RAD t ASR t RAH V IH ADDR V ROW IL t WCS ...

Page 18

WRITE and READ-MODIFY-WRITE cycles RAS CRP CASL#/CASH RAD t ASR t RAH V IH ADDR ROW IOH DQ V ...

Page 19

EDO-PAGE-MODE READ EARLY WRITE CYCLE V IH RAS CRP t RCD V IH CAS RAD t ASR t RAH V IH ADDR ROW WE IOH DQ OPEN ...

Page 20

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR WE OE TIMING PARAMETERS -5 SYMBOL MIN MAX ...

Page 21

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR RAS RPC CASL#/CASH ...

Page 22

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR ROW IOH DQx V IOL TIMING PARAMETERS -5 SYMBOL MIN MAX MIN ...

Page 23

RAS RPC CSR V IH CASL CASH WRP TIMING PARAMETERS -5 SYMBOL MIN MAX MIN t CHD ...

Page 24

TYP PIN #1 ID NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is .25mm per side. 8000 S. Federal ...

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