MT55L256L32FT-10 Micron Semiconductor Products, MT55L256L32FT-10 Datasheet
MT55L256L32FT-10
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MT55L256L32FT-10 Summary of contents
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... Industrial temperature range offered in specific speed grades and confgurations. Contact factory for more information. 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 100-Pin TQFP 165-Pin FBGA (Preliminary Package Data) 2 119-Pin BGA Part Number Example: MT55L256L32FT-11 ©2001, Micron Technology, Inc. ...
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SA0, SA1, SA MODE CE CLK K CKE# ADV/LD# BWa# BWb# R/W# OE# CE# CE2 CE2# 18 SA0, SA1, SA MODE CE CLK K CKE# ADV/LD# BWa# BWb# BWc# BWd# R/W# OE# CE# CE2 CE2# NOTE: Functional block diagrams ...
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GENERAL DESCRIPTION ® The Micron Zero Bus Turnaround family employs high-speed, low-power CMOS designs using an advanced CMOS process. Micron’s 8Mb ZBT SRAMs integrate a 512K x 18, 256K x 32, or 256K x 36 SRAM core with advanced synchronous ...
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TQFP PIN ASSIGNMENT TABLE PIN # x18 x32 x36 PIN # DQPc DQc DQc DQc DQc DQc DQc 31 ...
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ADV/LD# 85 OE# (G#) 86 CKE# 87 R/W# 88 CLK CE2# 92 BWa# 93 BWb CE2 97 CE# 98 ...
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TQFP PIN DESCRIPTIONS x18 x32/x36 32-35, 44-50, 32-35, 44-50, 80-83, 99, 81-83, 99, 100 100 – 95 – ...
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TQFP PIN DESCRIPTIONS (CONTINUED) x18 x32/x36 (a) 58, 59, 62, 63, (a) 52, 53, 56-59, 68, 69, 72-74 62 12, 13, (b) 68, 69, 72-75, 18, 19, 22-24 78, 79 (c) 2, ...
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CE# BWb# NC CE2# CKE CE2 NC BWa# CLK R/ ...
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FBGA PIN DESCRIPTIONS x18 x32/x36 SYMBOL 2A, 9A, 2B, 2A, 9A, 2B, 3P, 3R, 4P, 4R, 3P, 3R, 4P, 4R, 8P, 8R, 9P, 9R, 8P, 8R, 9P, 10A, 10B, 10P, 9R, 10A, 10B, 10R, 11A, 11R ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 8A 8A ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this input MODE (LB0#) (a) 10J, 10K, (a) 10J, 10K, 10L, 10M, 11D, 10L, 10M, 11J, 11E, 11F, 11G 11K, 11L, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 1H, 4C, 4N, 1H, 4C, 4N, 5C, 5D, 5E, 5F, 5C, 5D, 5E, 5F, 5G, 5H, 5J, 5G, 5H, 5J, 5K, 5L, 5M, 5K, 5L, 5M, 6C, 6D, 6E, 6F, 6C, 6D, 6E, ...
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CE2 SA ADV/LD DQb DQb V CE ...
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BGA PIN DESCRIPTIONS x32/x36 2A, 3A, 5A, 2A, 2C, 2R, 6A, 3B, 5B, 3A, 3B, 3C, 2C, 3C, 5C, 3T, 4T, ...
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BGA PIN DESCRIPTIONS (continued x32/x36 ADV#/LD# Input Synchronous Address Advance/Load: When HIGH, this input ...
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BGA PIN DESCRIPTIONS (continued x32/x36 3D, 3E, 3F, 3D, 3E, 3F, 3H, 3K, 3L, 3H, 3K, 3M, 3M, 3N, 3P, 3N, 3P, 5D, 5D, 5E, 5F, 5E, ...
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INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 LINEAR BURST ADDRESS TABLE (MODE = LOW) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 PARTIAL TRUTH TABLE FOR ...
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DS BEGIN READ READ READ BURST BURST READ KEY: COMMAND DS READ WRITE BURST NOTE STALL or IGNORE CLOCK EDGE cycle is not shown in the above diagram. This is because CKE# HIGH only blocks the clock (CLK) ...
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TRUTH TABLE (Notes 5-10) OPERATION DESELECT Cycle DESELECT Cycle DESELECT Cycle CONTINUE DESELECT Cycle READ Cycle (Begin Burst) READ Cycle (Continue Burst) NOP/DUMMY READ (Begin Burst) DUMMY READ (Continue Burst) WRITE Cycle (Begin Burst) WRITE Cycle (Continue Burst) NOP/WRITE ABORT ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply DD Relative to V .................................. -0.5V to +4.6V SS Voltage Supply DD Relative to V ..................................... -0. ............................................... -0. Storage Temperature (TQFP) ............ ...
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I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0°C ≤ T ≤ +70° +3.3V ±0.165V DESCRIPTION Input High (Logic 1) Voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage ...
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I OPERATING CONDITIONS AND MAXIMUM LIMITS DD (Note 1) (0°C ≤ T ≤ +70° +3.3V ±0.165V unless otherwise noted DESCRIPTION Device selected; All inputs ≤ V Power Supply or ≥ Cycle time ≥ Current: ...
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FBGA THERMAL RESISTANCE DESCRIPTION Junction to Ambient Test conditions follow standard test methods (Airflow of 1m/s) Junction to Case (Top) Junction to Pins (Bottom) AC ELECTRICAL CHARACTERISTICS (Notes (0°C ≤ T ≤ +70° DESCRIPTION Clock ...
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I/O AC TEST CONDITIONS Input pulse levels ................................... V Input rise and fall times ..................................... 1ns Input timing reference levels .......................... 1.5V Output reference levels ................................... 1.5V Output load ............................. See Figures 1 and 2 3.3V I/O Output Load ...
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SNOOZE MODE SNOOZE MODE is a low-current, “power-down” mode in which the device is deselected and current is reduced The duration of SNOOZE MODE dictated by the length of time the ZZ pin ...
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CLK t EVKH t KHEX t KHKL CKE# t CVKH t KHCX CE# ADV/LD# R/W# BWx ADDRESS t AVKH t KHAX DQ D(A1) t DVKH t KHDX OE# COMMAND WRITE WRITE D(A1) D(A2) READ/WRITE TIMING PARAMETERS ...
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CLK CKE# CE# ADV/LD# R/W# BWx ADDRESS D(A1) DQ COMMAND WRITE READ D(A1) Q(A2) NOP, STALL, AND DESELECT TIMING PARAMETERS -10 -11 SYM MIN MAX MIN MAX t KHQX 3.0 3.0 t KHQZ 5.0 5.0 NOTE: ...
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PIN #1 ID 14.00 ±0.10 +0.20 16.00 -0.05 NOTE: 1. All dimensions in millimeters. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT ...
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BALL A11 165X Ø 0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE-REFLOW DIAMETER IS Ø 0.40 7.50 ±0.05 15.00 ±0.10 7.00 ±0.05 5.00 ±0.05 NOTE: 1. All dimensions in millimeters MAX or typical where noted. ...
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A1 CORNER 0.75 ±0.15 Ø A1 CORNER 20.32 NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Solder ball pad is 0.6mm. 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: ...
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REVISION HISTORY Removed note "Not Recommended for New Designs," Rev. 6/01 ................................................................ June 7/01 Added industrial temperature references and notes, Rev. 3/01 ................................................................ March 19/01 Changed 16Mb references to 18Mb Changed NC/DQPx to NF/DQPx Added 119-pin PBGA package, Rev. 1/01, ...