SAM3S16C Atmel Corporation, SAM3S16C Datasheet - Page 61

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SAM3S16C

Manufacturer Part Number
SAM3S16C
Description
Manufacturer
Atmel Corporation
Datasheet

Specifications of SAM3S16C

Flash (kbytes)
1024 Kbytes
Pin Count
100
Max. Operating Frequency
100 MHz
Cpu
Cortex-M3
# Of Touch Channels
39
Hardware Qtouch Acquisition
No
Max I/o Pins
79
Ext Interrupts
79
Usb Transceiver
1
Quadrature Decoder Channels
2
Usb Speed
Full Speed
Usb Interface
Device
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
1000
Analog Comparators
1
Resistive Touch Screen
No
Dac Channels
2
Dac Resolution (bits)
12
Temp. Sensor
Yes
Crypto Engine
No
Sram (kbytes)
128
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
12.4.4
12.4.4.1
12.4.4.2
12.4.4.3
11117B–ATARM–18-Oct-11
Software ordering of memory accesses
DMB
DSB
ISB
Table 12-5.
1.
2.
The order of instructions in the program flow does not always guarantee the order of the corre-
sponding memory transactions. This is because:
“Memory system ordering of memory accesses” on page 17
memory system guarantees the order of memory accesses. Otherwise, if the order of memory
accesses is critical, software must include memory barrier instructions to force that ordering. The
processor provides the following memory barrier instructions:
The Data Memory Barrier (DMB) instruction ensures that outstanding memory transactions com-
plete before subsequent memory transactions. See
The Data Synchronization Barrier (DSB) instruction ensures that outstanding memory transac-
tions complete before subsequent instructions execute. See
The Instruction Synchronization Barrier (ISB) ensures that the effect of all completed memory
transactions is recognizable by subsequent instructions. See
Use memory barrier instructions in, for example:
Address range
0x60000000-
0x7FFFFFFF
0x80000000-
0x9FFFFFFF
0xA0000000-
0xBFFFFFFF
0xC0000000-
0xDFFFFFFF
0xE0000000-
0xE00FFFFF
0xE0100000-
0xFFFFFFFF
• the processor can reorder some memory accesses to improve efficiency, providing this does
• the processor has multiple bus interfaces
• memory or devices in the memory map have different wait states
• some memory accesses are buffered or speculative.
• MPU programming:
not affect the behavior of the instruction sequence.
– Use a DSB instruction to ensure the effect of the MPU takes place immediately at
the end of context switching.
See
The Peripheral and Vendor-specific device regions have no additional access constraints.
“Memory regions, types and attributes” on page 16
Memory region share ability policies (Continued)
Memory region
External RAM
External device
Private Peripheral
Bus
Vendor-specific
device
(2)
Memory type
Normal
Device
Strongly-
ordered
Device
“DMB” on page
(1)
(1)
(1)
(1)
for more information.
“DSB” on page
“ISB” on page
describes the cases where the
Shareability
-
Shareable
Non-
shareable
Shareable
-
102.
(1)
(1)
(1)
104.
103.
SAM3S16
WBWA
WT
-
-
-
(2)
(2)
19

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