ADP2102 Analog Devices, ADP2102 Datasheet - Page 4

• Manufacturer Part Number: ADP2102
• Description: Low Duty Cycle, 600 mA, 3 MHz Synchronous Step-Down DC-to-DC Converter
• Manufacturer: Analog Devices

ADP2102
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
AVIN, EN, MODE, FB/OUT to AGND
LX to PGND
PVIN to PGND
PGND to AGND
AVIN to PVIN
Operating Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
Soldering Conditions
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Monitoring ambient temperature does not guarantee that T is within the
specified temperature limits. In applications where high power dissipation
and poor thermal resistance are present, the maximum ambient temperature
may have to be derated. In applications with moderate power dissipation
and low PCB thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature is within
specification limits. The junction temperature (T ) of the device is dependent
on the ambient temperature (T ), the power dissipation of the device (PD),
and the junction-to-ambient thermal resistance of the package (θ ). Maximum
junction temperature (T ) is calculated from the ambient temperature (T )
and power dissipation (PD) using the formula T = T + (θ × PD).
otherwise specified, all other voltages are referenced to AGND.
The ADP2102 can be damaged when junction temperature limits are exceeded.
J
A
J
J
Rating
−0.3 V to (V
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
A
−0.3 V to +6 V
JA
J
JA
Unless
IN
+ 0.3 V)
1
A
Rev. B | Page 4 of 24
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, attention to thermal board
design is required. The value of θ
material, layout, and environmental conditions. Specified value
of θ
as per JEDEC standards. For more information, see Application
Note AN-772, A Design and Manufacturing Guide for the Lead
Frame Chip Scale Package (LFCSP).
Table 3. Thermal Resistance
Package Type
8-Lead LFCSP
Maximum Power Dissipation
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to PCB.
ESD CAUTION
JA
is based on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board,
JA
may vary, depending on PCB
θ
54
0.74
JA
JA
) of the package is
Unit
°C/W
W