5-2007615-5 TE Connectivity, 5-2007615-5 Datasheet

5-2007615-5

Manufacturer Part Number
5-2007615-5
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 5-2007615-5

Solder Ball
Tin-Silver
Product Height
5mm
Number Of Positions
200
Vacuum Cover
With
Contact Type
Socket
Contact Base Material
Copper Alloy
Contact Finish
Gold (30) over Nickel (50)
Connector Style
Receptacle
Housing Material
Thermoplastic - GF
Stack Height (mm [in])
15.00 [0.591], 17.00 [0.669], 18.00 [0.709], 20.00 [0.787], 25.00 [0.984], 30.00 [1.181]
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Packaging Method
Hard Tray

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
5-2007615-5
Manufacturer:
TE Connectivity AMP Connectors
Quantity:
12 000
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1.
1.1.
1.2.
1.3.
2.
2.1.
2.2.
3.
3.1.
3.2.
©2008 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
SCOPE
Content
This specification covers performance, tests and quality requirements for the STEP-Z* High Speed
Mezzanine 1.00 x 0.65 mm Ball Grid Array (BGA) Differential Connector System which provides for
interconnection of parallel printed wiring boards in low power applications.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 20Feb06. Additional
testing was completed on 12Jan07. The Qualification Test Report number for this testing is 501-627.
This documentation is on file at and available from Engineering Practices and Standards (EPS).
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless otherwise
specified, the latest edition of the document applies. In the event of conflict between the requirements of
this specification and the product drawing, the product drawing shall take precedence. In the event of
conflict between the requirements of this specification and the referenced documents, this specification
shall take precedence.
Tyco Electronics Documents
!
!
!
Industry Standard
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
Materials
Materials used in the construction of this product shall be as specified on the applicable product drawing.
109-197: Test Specification (AMP Test Specifications vs EIA and IEC Test Methods)
114-13101: Application Specification (STEP-Z* Printed Circuit (PC) Board Connectors)
501-627: Qualification Test Report(STEP-Z* High Speed Mezzanine 1.00 X 0.65 mm BGA
Differential Connector System
* Trademark
| Indicates change
Product
Specification
STEP-Z* High Speed Mezzanine 1.00 X 0.65 BGA
Differential Connector System
For latest revision, visit our website at www.tycoelectronics.com\documents.
For Regional Customer Service, visit our website at www.tycoelectronics.com
108-2143
18Jul08 Rev B
1 of 8
LOC B

Related parts for 5-2007615-5

5-2007615-5 Summary of contents

Page 1

... SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the STEP-Z* High Speed Mezzanine 1.00 x 0.65 mm Ball Grid Array (BGA) Differential Connector System which provides for interconnection of parallel printed wiring boards in low power applications. 1.2. Qualification When tests are performed on the subject product line, procedures specified in Figure 1 shall be used. ...

Page 2

... R 10 milliohms maximum. ) With a minimum of 500 data points, the following R shall apply maximum > 5 milliohms; 1% maximum > 10 milliohms; 0% > 50 milliohms. 5000 megohms minimum initial. 1000 megohms minimum final. ...

Page 3

... EIA-364-9. Mate and unmate specimens for 25 cycles at a maximum rate of 500 cycles per hour. The first 13 cycles shall be performed prior to specific environmental test in the sequence. The remaining 12 cycles shall be performed after environmental test. ...

Page 4

... EIA-364-31, Method III. Subject mated specimens to 50 cycles (500 hours) between 25 and 95% RH. Temperature / ramp shall be 1 hour per transition with 3 hour minimum dwell EIA-364-17, Method A, Test Condition 3, Test Time Condition C. Subject mated specimens for 500 hours ...

Page 5

... Class IIA for 20 days. After initial LLCR and 50% durability cycles, specimens shall be broken into 2 groups of 5. The plugs from the first group and the receptacles from the second group, shall be placed in the chamber unmated for 10 days. After 5 days unmated exposure, mate and recheck LLCR, then unmate and finish initial 10 days ...

Page 6

... First half of the total number of specified cycles. (g) Second half of the total number of specified cycles. (h) After initial LLCR and 50% durability cycles, specimens shall be broken into 2 groups of 5. The plugs from the first group and the receptacles from the second group, shall be placed in the chamber unmated for 10 days ...

Page 7

... Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production per Figure 2. Test group 1 requires 10 connector pairs terminated to LLCR PCB. Test group 2 requires 5 connector pairs terminated to LLCR PCB and a minimum of 3 connector pairs terminated to continuity PCB. Test group 3 requires 3 loose piece connector pairs ...

Page 8

Low Level Contact Resistance Measurement Points Rev B Figure 3 108-2143 ...

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