P-MCC8-2-3 Infineon Technologies, P-MCC8-2-3 Datasheet
P-MCC8-2-3
Specifications of P-MCC8-2-3
Related parts for P-MCC8-2-3
P-MCC8-2-3 Summary of contents
Page 1
... P P-MCC8-2-3 Wire Bond Mold Package For contactless application (Memory and Controller Pro May 2010 & ...
Page 2
... P-MCC8-2-3 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Further information is confidential and on request. Please contact: Important: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...
Page 3
... Contact Surface Ag Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). P-MCC8-2-3 P-MCC8-2-3 ...
Page 4
... Published by Infineon Technologies AG ...