P-MCC2-2-1 Infineon Technologies, P-MCC2-2-1 Datasheet

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... P-MCC2-2-1 Wire Bond Mold Package For contactless application (Memory Pro May 2010 & ...

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... P-MCC2-2-1Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Further information is confidential and on request. Please contact: Important: Infineon Technologies AG in Munich, Germany, Chip Card & Security ICs, E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

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... Ag Contact Surface Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). P-MCC2-2-1 P-MCC2-2-1 ...

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... Published by Infineon Technologies AG ...