P-FTM8-2-1 Infineon Technologies, P-FTM8-2-1 Datasheet

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P-FTM8-2-1

Manufacturer Part Number
P-FTM8-2-1
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of P-FTM8-2-1

Applications
Government Identation, e-Passport, Driver License
Pitch
9.5 mm
Dimensions
8.2 x 5.7
Thickness (max.)
260.0 µm
Contact Surface
NiAu
Ultrathin Wire Bond Mold Package
For contactless application (Controller)
P-FTM8-2-1
Sh o rt Pro d u c t O ve r vi e w
May 2010
Ch i p C a rd & Se c u ri t y

Related parts for P-FTM8-2-1

P-FTM8-2-1 Summary of contents

Page 1

... P-FTM8-2-1 Ultrathin Wire Bond Mold Package For contactless application (Controller Pro May 2010 & ...

Page 2

... P-FTM8-2-1 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Further information is confidential and on request. Please contact: Important: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

Page 3

... Contact Surface NiAu Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). P-FTM8-2-1 ...

Page 4

... Published by Infineon Technologies AG ...

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