P-M5.1 Infineon Technologies, P-M5.1 Datasheet

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... P-M5.1 Wire Bond Mold Package For contact based application (Controller) Short Product Overview May 2010 Chip Card & Security ...

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... P-M5.1 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

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... Thickness max. 600µm Contact Surface CIN+ Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). P-M5.1 P-M5.1 ...

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... Published by Infineon Technologies AG ...