SIGC25T120CL Infineon Technologies, SIGC25T120CL Datasheet
SIGC25T120CL
Specifications of SIGC25T120CL
Related parts for SIGC25T120CL
SIGC25T120CL Summary of contents
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... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC25T120CL Package Ordering Code Q67041- sawn on foil A4704-A003 mm 180 µ ...
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... Symbol Conditions =600V SIGC25T120CL Value 1200 -55 ... +150 Value min. typ. max. =1.5mA 1200 C =15A 1.8 2.2 2 4.5 5 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7141-P, Edition 2, 03.09.2003 SIGC25T120CL ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7141-P, Edition 2, 03.09.2003 SIGC25T120CL BSM15GD120DLC E3224 Package ECONO 2 short pin ...