SIGC32T120R3L Infineon Technologies, SIGC32T120R3L Datasheet

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SIGC32T120R3L

Manufacturer Part Number
SIGC32T120R3L
Description
Manufacturer
Infineon Technologies
Datasheet
1.SIGC32T120R3L.pdf (4 pages)

Specifications of SIGC32T120R3L

Technology
Low Loss IGBT 3
Vds (max)
1,200.0 V
Ic (max)
25.0 A
Vce(sat) (max)
2.05 V
Vge(th) (min)
5.0 V
IGBT
FEATURES:
Chip Type
MECHANICAL PARAMETER:
Raster size
Emitter pad size ( include gate pad )
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
Edited by INFINEON Technologies AI PS DD HV3, L7641B, Edition 2, 04.09.03
SIGC32T120R3L
1200V Trench + Field Stop technology
120µm chip
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling
3
Chip
V
1200V
CE
I
Cn
25A
Die Size
6.5 x 4.87 mm
This chip is used for:
Applications:
power module
drives
suitable for epoxy and soft solder die bonding
< 6 month at an ambient temperature of 23°C
store in original container, in dry nitrogen,
electrically conductive glue or solder
2
SIGC32T120R3L
1400 nm Ni Ag –system
1.14 x 1.14
31.6 / 21.5
6.5 x 4.87
3.4 x 4.99
0.65mm ; max 1.2mm
Package
3200 nm AlSiCu
120
150
180
sawn on foil
Al, <500µm
Photoimide
454 pcs
Ordering Code
A4206-A101
G
Q67050-
mm
mm
mm
µm
grd
C
E
2

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SIGC32T120R3L Summary of contents

Page 1

... Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, L7641B, Edition 2, 04.09.03 SIGC32T120R3L This chip is used for: power module Applications: drives I Die Size Cn 2 25A 6 ...

Page 2

... Symbol Conditions =600V SIGC32T120R3L Value 1200 -55 ... +150 Value min. typ. max. = 1mA 1200 C =25A 1.35 1.65 2. 5.0 5.8 6 =0V 3.35 ...

Page 3

... CHIP DRAWING: Edited by INFINEON Technologies HV3, L7641B, Edition 2, 04.09.03 SIGC32T120R3L ...

Page 4

... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L7641B, Edition 2, 04.09.03 SIGC32T120R3L tbd ...

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