SIGC42T60UN Infineon Technologies, SIGC42T60UN Datasheet
SIGC42T60UN
Specifications of SIGC42T60UN
Related parts for SIGC42T60UN
SIGC42T60UN Summary of contents
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... UPS I Die Size Cn 2 50A 6.5 x 6.5 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC42T60UN G Package Ordering Code sawn on foil SP0001-01820 6.5 x 6.5 42.25 / 35.6 2x( 3.0x2.85 ) 0.8 x 1.5 100 150 ...
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... Symbol Conditions =400V =50A =+15/ SIGC42T60UN Value 600 1 ) 150 20 -55 ... +150 Value min. typ. max. =2mA 600 C =50A 2 ...
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... CHIP DRAWING: Edited by INFINEON Technologies AIM PMD D CID CLS, L 7272U, Edition 1, 13. 09.2005 SIGC42T60UN ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies AIM PMD D CID CLS, L 7272U, Edition 1, 13. 09.2005 SIGC42T60UN SGW50N60HS Package :TO247 ...