IDD23E60 Infineon Technologies, IDD23E60 Datasheet
IDD23E60
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IDD23E60 Summary of contents
Page 1
... Symbol FSM I FRM Page 1 Product Summary V RRM jmax Marking Pin 1 PIN 2,4 NC D23E60 Value 600 RRM 41.6 27 tot 115.4 65.4 -55...+175 T stg 260 IDD23E60 600 1.5 V 175 °C PIN Unit °C °C 2007-04-24 ...
Page 2
... Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.2.2 Symbol R thJC R thJA = 25 °C, unless otherwise specified j Symbol Page 2 IDD23E60 Values Unit min. typ. max 1.3 K ...
Page 3
... Symbol t rr =25°C j =125°C j =150° rrm =25°C j =125°C j =150° =25°C j =125°C j =150° =25°C j =125°C j =150°C j Page 3 IDD23E60 Values Unit min. typ. max 120 - - 164 - - 170 - 19 21 970 - - 1580 - - 1770 ...
Page 4
... T A 125 °C 175 Typ. diode forward voltage 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 Page ≤ 175° 100 125 ) j 2 46A 23A 11,5A 1 -60 - IDD23E60 °C 175 T C 100 °C 160 T j 2007-04-24 ...
Page 5
... F = 400V 125 ° 46A 23A 11.5A 200 300 400 500 600 700 /dt 400V 125° 200 300 400 500 600 700 IDD23E60 800 A/µs 1000 di /dt F 46A 23A 11.5A 800 A/µs 1000 di /dt F 2007-04-24 ...
Page 6
... Max. transient thermal impedance thJC p parameter : IDD23E60 10 K single pulse - Rev.2 0.50 0.20 0.10 0.05 0.02 0. Page 6 IDD23E60 2007-04-24 ...
Page 7
... D 0.63 0.89 E 2.28 F 2.19 2.39 G 0.76 0.98 H 0.90 1.21 K 5.97 6.23 L 9.40 10.40 M 0.46 0.58 N 0.87 1. 0.26 1. Page 7 IDD23E60 inch] min max 0.2520 0.2650 0.2067 0.2165 (0.0256) (0.0453) 0.0248 0.0350 0.2520 0.0862 0.0941 0.0299 0.0386 0.0354 0.0476 0.2350 0.2453 0.3701 0.4094 0.0181 0.0228 0.0343 0.0453 0.0201 - 0.1969 - 0.1642 - 0.0102 0.0402 - - 2007-04-24 ...
Page 8
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev.2.2 Page 8 IDD23E60 2007-04-24 ...