NSSM038A Nichia, NSSM038A Datasheet - Page 15



Manufacturer Part Number

Specifications of NSSM038A

Size Lxwxh (mm)
Lumi-nous Inten-sity Typ(cd)
Forward Voltage Vf(v) Typ
Forward Voltage Vf(v) Max
Directivity (degree)
If (ma)
Mounting Style
Through Hole
(4) Design Consideration
(5) Electrostatic Discharge (ESD)
(6) Thermal Management
(7) Cleaning
(8) Eye Safety
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not using hands.
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
● If tools or equipment contain insulating materials such as glass or plastic,
● The customer is advised to check if the LEDs are damaged by ESD
● LEDs with ESD-damaged dice (i.e. other than red) may have an increased leakage current, current flow at a low voltage,
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
● Drive current should be determined for the surrounding ambient temperature (T
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Surge protection should be considered when designing of commercial products.
the following measures against electrostatic discharge are strongly recommended:
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
or no longer illuminate at a low current.
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (T
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
please be careful to avoid adverse effects on the human body caused by light stimulation.
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
Failure Criteria: V
<2.0V at I
) to dissipate the heat from the product.

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