BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 


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Page 135/163:

EMIFILr (Soldering and Mounting)

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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.

EMIFILr (Soldering and Mounting)

1. Standard Land Pattern Dimensions
The capacitor type Chip EMIFILr (NFp series) / Chip EMIGUARDr (VFM series) suppress noise by conducting the high-
frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should
be made as large as possible during the PCB design stage. As shown in the right, one side of the PCB is used for chip
mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-
frequency impedance of the grounding and maximizes the filter's performance. Please contact us if using a thinner land pad
than 18 m for NFM55P.
oReflow and Flow
BLM03
BLM15
BLM Series
BLM18
BLM21
BLM31
BLM41
Type
BLM03
BLM15
BLM18
(except 18PG type)
BLM21
(except 21PG type)
BLM31
(except 31PG type)
BLM41
(except 41Pp type)
BLM03/15 is specially adapted for reflow soldering.
Flow Mounting in High Density for BLM31/41
Type
BLM31
BLM41
oDo not apply narrower pattern that listed above to BLMppP.
Narrow pattern can cause excessive heat or open circuit.
6
oReflow soldering
BLA2A
BLA31
BLA2A
134
(Except BLMppP series)
a
b
Soldering
a
b
c
Reflow
0.2-0.3
0.6-0.9
0.3
Reflow
0.4
1.2-1.4
0.5
Flow
2.2-2.6
0.7
0.7
Reflow
1.8-2.0
1.2
3.0-4.0
1.0
Flow/
2.0
4.2-5.2
Reflow
1.2
3.0
5.5-6.5
a
b
d
e
a
b
c
d
e
2.0
4.2-5.2
1.2
1.3
1.35
3.0
5.5-6.5
1.2
1.8
1.5
1.75
0.5 Pitch
0.25
• If there are high amounts of self-heating on pattern, the
contact points of PCB and part may become damaged.
C31E9.pdf 03.3.12
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
BLMppP
a
b
Land pad thickness
Rated
and dimension d
Type
Current
Soldering
a
b
c
(A)
18 m 35 m 70 m
0.5-1.5
0.7
Flow
2.2-2.6
BLM18PG
2
0.7
0.7
1.2
Reflow
3
1.8-2.0
2.4
1.5
1.0
2
1.2
BLM21PG
1.2
3.0-4.0
1.0
3
2.4
Flow/
6
6.4
Reflow
1.5/2
1.2
BLM31PG
3
2.0
4.2-5.2
2.4
6
6.4
1.2
1-2
1.2
BLM41Pp
3
3.0
5.5-6.5
2.4
6
6.4
oReflow and Flow
BLA31
2.8
0.8 Pitch
0.4
Continued on the following page.
(in mm)
0.7
0.7
0.7
0.7
1.2
0.7
1.0
1.0
1.0
1.0
1.2
1.0
3.3
1.65
1.2
1.2
1.2
1.2
3.3
1.65
1.2
1.2
1.2
1.2
3.3
1.65