LM2588S-3.3 National Semiconductor, LM2588S-3.3 Datasheet - Page 26

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LM2588S-3.3

Manufacturer Part Number
LM2588S-3.3
Description
SIMPLE SWITCHER 5A Flyback Regulator with
Manufacturer
National Semiconductor
Datasheet

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Application Hints
CIRCUIT LAYOUT GUIDELINES
As in any switching regulator, layout is very important. Rap-
idly switching currents associated with wiring inductance
generate voltage transients which can cause problems. For
minimal inductance and ground loops, keep the length of the
leads and traces as short as possible. Use single point
grounding or ground plane construction for best results.
Separate the signal grounds from the power grounds (as in-
dicated in Figure 48 ). When using the Adjustable version,
physically locate the programming resistors as near the
regulator IC as possible, to keep the sensitive feedback wir-
ing short.
HEAT SINK/THERMAL CONSIDERATIONS
In many cases, a heat sink is not required to keep the
LM2588 junction temperature within the allowed operating
temperature range. For each application, to determine
whether or not a heat sink will be required, the following must
be identified:
1) Maximum ambient temperature (in the application).
2) Maximum regulator power dissipation (in the application).
3) Maximum allowed junction temperature (125˚C for the
LM2588). For a safe, conservative design, a temperature ap-
proximately 15˚C cooler than the maximum junction tem-
perature should be selected (110˚C).
4) LM2588 package thermal resistances
in the Electrical Characteristics).
Total power dissipated (P
as follows:
Boost:
V
N is the transformer turns ratio, D is the duty cycle, and I
IN
is the minimum input voltage, V
D
) by the LM2588 can be estimated
(Continued)
OUT
is the output voltage,
JA
and
FIGURE 48. Circuit Board Layout
JC
(given
LOAD
26
is the maximum load current (and I
maximum load currents for multiple-output flyback regula-
tors). The duty cycle is given by:
Boost:
where V
typically 0.5V for Schottky diodes and 0.8V for fast recovery
diodes. V
found in the Characteristic Curves.
When no heat sink is used, the junction temperature rise is:
Adding the junction temperature rise to the maximum ambi-
ent temperature gives the actual operating junction tempera-
ture:
If the operating junction temperature exceeds the maximum
junction temperatue in item 3 above, then a heat sink is re-
quired. When using a heat sink, the junction temperature rise
can be determined by the following:
Again, the operating junction temperature will be:
As before, if the maximum junction temperature is exceeded,
a larger heat sink is required (one that has a lower thermal
resistance).
Included in the Switchers Made Simple design software is a
more precise (non-linear) thermal model that can be used to
determine junction temperature with different input-output
parameters or different component values. It can also calcu-
late the heat sink thermal resistance required to maintain the
regulator junction temperature below the maximum operat-
ing temperature.
F
SAT
is the forward biased voltage of the diode and is
T
J
is the switch saturation voltage and can be
= P
D
• (
T
T
T
J
JC
J
J
= T
= T
= P
+
D
Interface
J
J
+ T
+ T
JA
A
A
.
LOAD
.
+
DS012420-59
Heat Sink
is the sum of the
)

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