BGA425 Infineon Technologies Corporation, BGA425 Datasheet

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BGA425

Manufacturer Part Number
BGA425
Description
Si-mmic-amplifier in Sieget 25-technologie
Manufacturer
Infineon Technologies Corporation
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BGA425
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Thermal Resistance
Junction - soldering point
Si-MMIC-Amplifier






Tape loading orientation
ESD : E lectro s tatic d ischarge sensitive device,
Type
BGA 425 BMs
Maximum Ratings
Parameter
Device current
Device voltage
Total power dissipation , T
RF input power
Junction temperature
Ambient temperature
Storage temperature
1 T
Multifunctional casc. 50
Unconditionally stable
Gain |S
Noise figure NF = 2.2 dB at 1.8 GHz
Reverse isolation >28 dB (appl.1) >35 dB (Appl.2)
Typical device voltage V
gain |S
IP
S
Direction of Unreeling
is measured on the ground lead at the soldering point to the pcb
3out
observe handling precaution!
= +7 dBm at 1.8 GHz (V
21
21
|
Marking
|
2
2
Top View
6
1 2 3
= 22 dB at 1.8 GHz (Appl.2)
= 18.5 dB at 1.8 GHz (Appl.1)
W1s
5
4
1,OutB
in SIEGET 25-Technologie
S

D
= 120 °C
Marking on SOT-363 package
(for example W1s)
corresponds to pin 1 of device
Position in tape: pin 1
opposite of feed hole side
= 2 V to 5 V
block (LNA / MIX)
2,GND
D
=3V,I
1)
D
Pin Configuration
=9.5mA)
3,OutA
EHA07193
1
4,IN
Symbol
I
V
P
P
T
T
T
R
D
j
A
stg
D
tot
RFin
thJS
,+V
IN
4
5,GND
6
Circuit Diagram
5
-65 ... 150
-65 ... 150
Value

6,+V
150
150
-10
25
335
4
6
2, 5
GND
Package
SOT-363
Oct-12-1999
1
BGA 425
VPS05604
6
3
1
2
Unit
mA
V
mW
dBm
°C
K/W
EHA07371
OUTA
OUTB
+
V
3

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BGA425 Summary of contents

Page 1

Si-MMIC-Amplifier in SIEGET 25-Technologie Multifunctional casc Unconditionally stable  2 Gain | 18 1.8 GHz (Appl. gain | 1.8 GHz (Appl. ...

Page 2

Electrical Characteristics at T Parameter AC characteristics Device current Insertion power gain f = 0.1 GHz GHz f = 1.8 GHz Reverse isolation f = 1.8 GHz Noise figure f = 0.1 ...

Page 3

Typical configuration Application (LNA) Application 4 (Mix) Appl.1 100 pF RF OUT BGA 425 100 Appl.3 100 pF 100 pF RF OUT BGA 425 100 Note: 1) ...

Page 4

Electrical characteristics Application Applic. Insertion Gain (dB) 21 Frequ. (GHz) 0 18.5 1 (LNA (LNA ...

Page 5

For linear simulation please use on-wafer measurement data of our T501 chip an add resistive and capacitive elements, parasitics and package equivalent circuit. S-Parameters ° GHz MAG ANG T1 1.7 ...

Page 6

Spice model +V BGA 425-chip including parasitics C’-E’- Diode 12, 15 GND ...

Page 7

Transistor Chip Data T1 (Berkley-SPICE 2G.6 Syntax) : 0.21024 39.251 V VAF = 1.7763 - NE = 34.368 V VAR = 1.3152 - NC = 1.3491 RBM =  3.7265 fF CJE = 4.5899 ...

Page 8

Insertion power gain | parameter VD=5V, ID=17.5mA VD=4V, ID=13.3mA dB VD=3V, ID=9.5mA VD=2V, ID=5.2mA Intercept point at the output IP = ...

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