MT9M012 Aptina Imaging Corporation, MT9M012 Datasheet

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MT9M012

Manufacturer Part Number
MT9M012
Description
1.6Mp CMOS Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet
1/4.5-Inch, 1.6Mp CMOS Digital Image Sensor Die
MT9M012
For the product data sheet, refer to Aptina’s Web site: www.Aptina.com
Features
• DigitalClarity
• High frame rate (1280H x 720V/50 fps)
• Superior low-light performance
• Low dark current
• Global reset release (GRR) for simultaneous
• Simple two-wire serial interface
• Programmable controls: gain, frame rate, frame size,
• Horizontal and vertical mirror image
• Automatic black level calibration
• On-die phase-locked loop (PLL) oscillator
• Bulb exposure mode for arbitrary exposure times
• Snapshot mode to take frames on demand
• Parallel data output
• Electronic rolling shutter (ERS), progressive scan
• Arbitrary image decimation with anti-aliasing
• Programmable power-down mode (mode A or mode B)
• Xenon and LED flash support with fast exposure
• Flexible support for external auto focus, optical
General Physical Specifications
• Die thickness: 200µm ±12µm
• Backside wafer surface of bare silicon
• Typical metal 1 thickness: 3.1kÅ
• Typical metal 2 thickness: 3.1kÅ
• Typical metal 3 thickness: 6.1kÅ
• Metallization composition: 99.5 percent Al and 0.5
• Typical topside passivation:
• Passivation openings (MIN): 75µm x 90µm
Order Information
MT9M012D00STM
PDF: 3518383133/Source: 6156369317
MT9M012_DDS - Rev. C; Pub. 5/10 EN
Products and specifications discussed herein are subject to change by Aptina without notice. Specifications discussed herein are subject to
exposure of all rows
exposure
adaptation
zoom, and mechanical shutter
(Consult factory for other thickness)
percent Cu over Ti
2.2kÅ nitride over 6.0kÅ of undoped oxide
change without notice. This product is sold “as is” and is delivered with no guarantees or warranties, express or implied.
®
CMOS imaging technology
1
Die Database
• Die outline, see Figure 2 on page 11
• Singulated die size
• Bond Pad Identification Tables, see pages 5–10
Options
• Form
• Testing
Notes: 1. Consult die distributor or factory before ordering to
Key Performance Parameters
• Optical format: 1/4.5-inch (4:3)
• Active imager size: 3.24mm(H) x 2.41mm(V),
• Active pixels: 1472H x 1096V
• Pixel size: 2.2µm x 2.2µm
• Color filter array: monochrome
• Shutter type
• Maximum data rate: 82 Mp/s
• Master clock: 41 MHz
• Frame rate
• ADC resolution: 12-bit, on-die
• Responsivity: 1.4 V/lux-sec (550nm)
• Dynamic range: 70.1dB
• SNR MAX: 38.1dB
– 6,748µm ±25µm x 6,351µm ±25µm
– Die
– Standard (level 1) probe
4.04mm diagonal
– Global reset release (GRR), snapshot only
– Electronic rolling shutter (ERS)
– 1440H x 1080V, programmable up to 30 fps
– 1280H x 720V, programmable up to 50 fps
MT9M012: 1.6Mp CMOS Digital Image Sensor Die
Product#
verify long-term availability of these die products.
Form
MT9M012D00STM
Aptina reserves the right to change products or specifications without notice.
Temp
Chrom
©2008 Aptina Imaging Corporation All rights reserved.
database
Designator
www.DataSheet4U.com
Die
C1
D
Features
Testing
level

Related parts for MT9M012

MT9M012 Summary of contents

Page 1

... Products and specifications discussed herein are subject to change by Aptina without notice. Specifications discussed herein are subject to change without notice. This product is sold “as is” and is delivered with no guarantees or warranties, express or implied. MT9M012: 1.6Mp CMOS Digital Image Sensor Die Die Database • Die outline, see Figure 2 on page 11 • ...

Page 2

... Operating temperature: –30°C to +70°C General Description The Aptina™ MT9M012 is a 1/4.5-inch format CMOS active-pixel digital image sensor die with a pixel array of 1472H x 1096V. The default active imaging array size is 1440H x 1080V. It incorporates sophisticated on-die camera functions such as windowing, mirroring, and snapshot mode ...

Page 3

... Bonding Instructions The MT9M012 imager die has 124 bond pads. Refer to Table 1 and Table 2 on pages 5–10 for a complete list of bond pads and coordinates. The MT9M012 imager die does not require the user to determine bond option features. The die also has several pads defined as “do not use.” These pads are reserved for engi- neering purposes and should not be used ...

Page 4

... Typical connection shows only one scenario out of multiple possible variations for this sensor. 2. All inputs must be configured with All power supplies should be adequately decoupled. 5. All PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die V _IO Vdd_IO V ...

Page 5

... OUT OUT OUT 41 V _IO8 _IO7 DD PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 “X” “Y” Microns Microns 0.00 141.84 283.68 414.72 568.14 726.48 857.52 1050.32 1232.64 1363.68 1556.48 1738.80 1869.84 4 2062.64 2244 ...

Page 6

... DD 83 TEST GND 85 V _IO22 OUT PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 6098.87 –1995.02 6098.87 –2126.86 6098.87 –2382.79 6098.87 –2514.63 6098.87 –2646.47 6098.87 – ...

Page 7

... DNU = do not use. See “Bonding Instructions” on page 3. 3. All TEST bond pads must be tied LINE_VALID requires an external pull-down resistor (typically 10k–100kΩ) to DGND for normal device operation. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 1553 ...

Page 8

... OUT 41 V _IO8 _IO7 GND 2 44 DNU PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 “X” “Y” Microns Microns –2865.08 3035.07 –2723.24 3035.07 –2581.40 3035.07 –2450.36 3035.07 –2296.95 3035.07 –2138.60 3035.07 – ...

Page 9

... GND 85 V _IO22 OUT GND 88 V _IO21 DD PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 3233.79 652.28 3233.79 520.44 3233.79 388.60 3233.79 132.67 3233.79 0.83 3233.79 –131.01 3233.79 – ...

Page 10

... DNU = do not use. See “Bonding Instructions” on page 3. 3. All TEST bond pads must be tied LINE_VALID requires an external pull-down resistor (typically 10k–100kΩ) to DGND for normal device operation. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns – ...

Page 11

... PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die Center of pad 1 (Table 1) or center of die (Table First clear pixel (col ...

Page 12

... Last clear pixel (col. 1,471, row 1,147) From die center: From center of pad 1: Figure 3: Die Orientation in Reconstructed Wafer 276mm PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 276mm 12 Physical Specifications www.DataSheet4U.com Dimensions 200μm ±12μm 6,748 ±25μm 6,351 ± ...

Page 13

... This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die Aptina reserves the right to change products or specifications without notice. 13 Revision History www.DataSheet4U.com © ...

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