MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet
MT9M114
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MT9M114 Summary of contents
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die MT9M114 Die Data Sheet For the product data sheet, refer to Aptina’s Web site: Features ® • DigitalClarity CMOS Imaging technology • System-on-a-chip (SOC)—Completely integrated camera system • ...
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... FRAME_VALID and LINE_VALID signals indicate the active video. Output pads can also be tri-stated by de-asserting the OE_BAR signal. The MT9M114 die internal registers can be configured using a two-wire serial interface. Die Testing Procedures Aptina imager die products are tested with a standard probe (C1) test. Wafer probe is performed at an elevated temperature to test product functionality in Aptina’ ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Bonding Instructions The MT9M114 Imager die has 55 bond pads. Refer to Table 1 on page 5 and Table 2 on page 7 for a complete list of bond pads and coordinates. The MT9M114 Imager die does not require the user to determine bond option features. ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital 4. Aptina recommends a 1.5kΩ resistor value for the two-wire serial interface R values may be used for slower transmission speed. 5. All inputs must be configured with V 6. RESET_BAR has an internal pull-up resistor and can be left floating. 7. Aptina recommends that 0.1μF and 1μF decoupling capacitors for each power supply are mounted as close as possible to the pad ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Bond Pad Location and Identification Tables Table 1: Bond Pad Location and Identification From Center of Pad 1 Pad Number Pad Name 1 GND_PLL0 2 FLASH PIXCLK 5 EXTCLK 6 GND7 7 GND6 8 Reserved CHAIN 11 TRST_BAR 12 CONFIG ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 1: Bond Pad Location and Identification From Center of Pad 1 (continued) Pad Number Pad Name OUT 46 GND3 47 DOUT_LSB0 GND4 50 V _PHY0 DD 51 DATA_P 52 DATA_N 53 CLK_N 54 CLK_P 55 V _PLL0 DD Notes: 1. Reference to center of each bond pad from center of bond pad 1. ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 2: Bond Pad Location and Identification Pad Number Pad Name 1 GND_PLL0 2 FLASH PIXCLK 5 EXTCLK 6 GND7 7 GND6 2 8 Reserved 9 V _IO4 DD 10 CHAIN 11 TRST_BAR 12 CONFIG 13 S ADDR 14 S CLK DATA ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 2: Bond Pad Location and Identification Pad Number Pad Name 45 D _LSB1 OUT 46 GND3 47 DOUT_LSB0 GND4 50 V _PHY0 DD 51 DATA_P 52 DATA_N 53 CLK_N 54 CLK_P 55 V _PLL0 DD Notes: 1. Reference to center of each bond pad from center of die (0, 0). ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Die Features Figure 2: Die Outline (Top View Notes: 1. This figure is not drawn to scale. PDF: 0834020843/Source:7792798679 MT9M114 DDS - Rev. A 9/09 EN Aptina Confidential and Proprietary ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Physical Specifications Table 3: Die Dimensions Features Die thickness Singulated die size Width: Length: Bond pad size (MIN) Passivation openings (MIN) Minimum bond pad pitch Optical array Optical center from die center: First active pixel (col. 8, row 2) From die center: Last active pixel (col ...
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... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Revision History Rev .9/25/09 • ...