MT9M114

Manufacturer Part NumberMT9M114
Description1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
ManufacturerAptina Imaging Corporation
MT9M114 datasheet
 
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MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
1/6-Inch 720P High-Definition (HD)
System-On-A-Chip (SOC) Digital Image Sensor Die
MT9M114 Die Data Sheet
For the product data sheet, refer to Aptina’s Web site:
Features
®
• DigitalClarity
CMOS Imaging technology
• System-on-a-chip (SOC)—Completely integrated
camera system
• Ultra low-power, low-cost CMOS image sensor
• Superior low-light performance
• Electronic rolling shutter (ERS)
• Up to 30 fps progressive scan for high-quality video
at 720p resolution
• On-die image flow processor (IFP) performs
sophisticated processing: color recovery and
correction, sharpening, gamma, lens shading
correction, on-the-fly defect correction, zoom
• Image decimation to arbitrary size with smooth,
continuous zoom and pan
• Automatic exposure, white balance and black
compensation, color saturation, and defect
identification and correction, aperture correction
• Two-wire serial programming interface
• Progressive ITU-R BT.656 (YCbCr), YUV, 565RGB,
555RGB, or 444RGB output data formats
• Adaptive Polynomial lens shading correction
• UVC interface
• Perspective correction
• Multi-camera sync
General Physical Specifications
• Die thickness: 200 µm ±12 µm
(Consult factory for other die thickness)
• Back side die surface of polished bare silicon
• Typical metal 1 thickness: 3.1 kÅ
• Typical metal 2 thickness: 3.1 kÅ
• Typical metal 3 thickness: 3.1 kÅ
• Typical metal 4 thickness: 4.15 kÅ
• Metallization composition: 99.5 percent Al and 0.5
percent Cu over Ti
• Typical topside passivation:
2.2 kÅ nitride over 5.0 kÅ of undoped oxide
• Passivation openings (MIN): 75 µm x 90 µm
Die Database
• Die outline, see Figure 2 on page 9
• Singulated die size (nominal dimension):
3858 µm ±25 µm x 4658 µm ±25 µm
• “Bond Pad Location and Identification Tables”, see
page 5–8
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Aptina without
notice. Products are only warranted by Aptina to meet Aptina’s production data sheet specifications.
Aptina Confidential and Proprietary
www.aptina.com
Order Information
Die: MT9M114D00STCK24BC1
Note: Consult die distributor or factory before order-
ing to verify long-term availability of these
die products.
Options
• Form
– Die
• Testing
– Standard (level 1) probe
Form
Product#
MT9M114D00STCK224BC1
Key Performance Parameters
• Optical format: 1/6-inch (4:3)
• Active imager size: 2.45 mm(H) x 1.84 mm(V),
3.06 mm diagonal
• Active pixels: 1296 H x 976 V (1.2Mp)
• Pixel size:1.9 µm x 1.9 µm
• Color filter array: RGB Bayer pattern
• Shutter type: electronic rolling shutter (ERS)
• Maximum data rate/master clock: 48 MPS/96 MHz
• Frame rate: 720p (1280 H x 720 V) 30 fps at 96 MHz
(default), assuming a 24Mhz EXTCLK
• ADC resolution: 10-bit, on die
• Responsivity: 0.95V/lux-sec (550 nm)
• Pixel dynamic range: 70 dB
• SNR MAX: 40 dB
• Supply voltage:
- I/O digital: 1.8 V or 2.8 V
- Core digital: 1.8 V
- Analog: 2.8 V
– PLL voltage:2.8V
– MIPI voltage:1.8V
• Typical power consumption: 150.7 mW
• Operating temperature: –30°C to +70°C
• Chief ray angle (CRA): 25.18°
1
Advance
Image Sensor Die
www.DataSheet4U.com
D
C1
Die
Testing
Temp
Chrom
database
level
Aptina reserves the right to change products or specifications without notice.
©2009 Aptina Imaging Corporation All rights reserved.

MT9M114 Summary of contents

  • Page 1

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die MT9M114 Die Data Sheet For the product data sheet, refer to Aptina’s Web site: Features ® • DigitalClarity CMOS Imaging technology • System-on-a-chip (SOC)—Completely integrated camera system • ...

  • Page 2

    ... FRAME_VALID and LINE_VALID signals indicate the active video. Output pads can also be tri-stated by de-asserting the OE_BAR signal. The MT9M114 die internal registers can be configured using a two-wire serial interface. Die Testing Procedures Aptina imager die products are tested with a standard probe (C1) test. Wafer probe is performed at an elevated temperature to test product functionality in Aptina’ ...

  • Page 3

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Bonding Instructions The MT9M114 Imager die has 55 bond pads. Refer to Table 1 on page 5 and Table 2 on page 7 for a complete list of bond pads and coordinates. The MT9M114 Imager die does not require the user to determine bond option features. ...

  • Page 4

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital 4. Aptina recommends a 1.5kΩ resistor value for the two-wire serial interface R values may be used for slower transmission speed. 5. All inputs must be configured with V 6. RESET_BAR has an internal pull-up resistor and can be left floating. 7. Aptina recommends that 0.1μF and 1μF decoupling capacitors for each power supply are mounted as close as possible to the pad ...

  • Page 5

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Bond Pad Location and Identification Tables Table 1: Bond Pad Location and Identification From Center of Pad 1 Pad Number Pad Name 1 GND_PLL0 2 FLASH PIXCLK 5 EXTCLK 6 GND7 7 GND6 8 Reserved CHAIN 11 TRST_BAR 12 CONFIG ...

  • Page 6

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 1: Bond Pad Location and Identification From Center of Pad 1 (continued) Pad Number Pad Name OUT 46 GND3 47 DOUT_LSB0 GND4 50 V _PHY0 DD 51 DATA_P 52 DATA_N 53 CLK_N 54 CLK_P 55 V _PLL0 DD Notes: 1. Reference to center of each bond pad from center of bond pad 1. ...

  • Page 7

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 2: Bond Pad Location and Identification Pad Number Pad Name 1 GND_PLL0 2 FLASH PIXCLK 5 EXTCLK 6 GND7 7 GND6 2 8 Reserved 9 V _IO4 DD 10 CHAIN 11 TRST_BAR 12 CONFIG 13 S ADDR 14 S CLK DATA ...

  • Page 8

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Table 2: Bond Pad Location and Identification Pad Number Pad Name 45 D _LSB1 OUT 46 GND3 47 DOUT_LSB0 GND4 50 V _PHY0 DD 51 DATA_P 52 DATA_N 53 CLK_N 54 CLK_P 55 V _PLL0 DD Notes: 1. Reference to center of each bond pad from center of die (0, 0). ...

  • Page 9

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Die Features Figure 2: Die Outline (Top View Notes: 1. This figure is not drawn to scale. PDF: 0834020843/Source:7792798679 MT9M114 DDS - Rev. A 9/09 EN Aptina Confidential and Proprietary ...

  • Page 10

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Physical Specifications Table 3: Die Dimensions Features Die thickness Singulated die size Width: Length: Bond pad size (MIN) Passivation openings (MIN) Minimum bond pad pitch Optical array Optical center from die center: First active pixel (col. 8, row 2) From die center: Last active pixel (col ...

  • Page 11

    ... MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Revision History Rev .9/25/09 • ...