MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet - Page 2

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MT9M114

Manufacturer Part Number
MT9M114
Description
1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet

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General Description
Die Testing Procedures
Functional Specifications
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
The Aptina MT9M114 die is a 1.2Mp-format 1/6-inch CMOS active-pixel digital image
sensor using Aptina’s latest digital image flow processor (IFP) technology. The MT9M114
has an active imaging pixel array of 1296 x 976, capturing high-quality color images at
1.2Mp resolution. The sensor is a complete camera system-on-a-chip solution and is
designed specifically to meet the demands of products in PC and Notebook camera
applications. It incorporates multiple sophisticated on-die camera functions and is
programmable through a simple two-wire serial interface.
This SOC (system-on-a-chip) 1.2Mp CMOS image sensor die features
DigitalClarity
achieves near- CCD image quality (based on signal-to-noise ratio and low-light sensi-
tivity) while maintaining the inherent size, cost, and integration advantages of CMOS.
The MT9M114 die is a fully-automatic, single-chip camera, requiring only a power
supply, lens and clock source for basic operation. Output video is streamed through a
parallel 8-bit D
used to latch the data, while FRAME_VALID and LINE_VALID signals indicate the active
video. Output pads can also be tri-stated by de-asserting the OE_BAR signal. The
MT9M114 die internal registers can be configured using a two-wire serial interface.
Aptina imager die products are tested with a standard probe (C1) test. Wafer probe is
performed at an elevated temperature to test product functionality in Aptina’s standard
package. Because the package environment is not within Aptina’s control, the user must
determine the necessary heat sink requirements to ensure that the die junction temper-
ature remains within specified limits.
Image quality is verified through various imaging tests. The probe functional test flow
provides test coverage for the on-die A/D converter, logic, serial interface bus, and pixel
array. Test conditions, margins, limits, and test sequence are determined by individual
product yields and reliability data.
Aptina retains a wafer map of each wafer as part of the probe records, along with a lot
summary of wafer yields for each lot probed. Aptina reserves the right to change the
probe program at any time to improve the reliability, packaged device yield, or perfor-
mance of the product.
Die users may experience differences in performance relative to Aptina’s data sheets.
This is due to differences in package capacitance, inductance, resistance, and trace
length.
The specifications provided in this document are for reference only. For target functional
and parametric specifications, refer to the product data sheet found on Aptina’s Web
site.
MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
®
—Aptina’s breakthrough, low-noise CMOS imaging technology that
Aptina Confidential and Proprietary
OUT OR
MIPI port as shown in Figure 1 on page 3. Output pixel clock is
2
Aptina reserves the right to change products or specifications without notice.
©2009 Aptina Imaging Corporation. All rights reserved.
Image Sensor Die
www.DataSheet4U.com
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