MT9M114 Aptina Imaging Corporation, MT9M114 Datasheet - Page 6

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MT9M114

Manufacturer Part Number
MT9M114
Description
1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
Manufacturer
Aptina Imaging Corporation
Datasheet

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Table 1:
PDF: 0834020843/Source:7792798679
MT9M114 DDS - Rev. A 9/09 EN
Pad Number
44
45
46
47
48
49
50
51
52
53
54
55
Bond Pad Location and Identification From Center of Pad 1 (continued)
Notes:
1. Reference to center of each bond pad from center of bond pad 1.
2. DNU = do not use. See “Bonding Instructions” on page 3.
DOUT_LSB0
D
Pad Name
V
V
V
DATA_N
DATA_P
OUT
DD
DD
CLK_N
CLK_P
DD
GND3
GND4
V
_PHY0
MT9M114 1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital
DD
_PLL0
_IO3
_LSB1
1
Aptina Confidential and Proprietary
Microns
“X”
0
0
0
0
0
0
0
0
0
0
0
0
1
6
–1166.24
Microns
–2290.8
–2133.6
–1976.4
–1819.2
–1504.8
–1347.6
–946.24
–558.56
–338.56
–157.2
–1662
“Y”
1
Aptina reserves the right to change products or specifications without notice.
Inches
“X”
0
0
0
0
0
0
0
0
0
0
0
0
©2009 Aptina Imaging Corporation. All rights reserved.
1
Image Sensor Die
www.DataSheet4U.com
–0.090188976
–0.077811024
–0.071622047
–0.065433071
–0.059244094
–0.053055118
–0.045914961
–0.037253543
–0.021990551
–0.013329134
–0.006188976
–0.084
Inches
“Y”
Advance
1

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