MT9M012 Aptina Imaging Corporation, MT9M012 Datasheet - Page 3

• Manufacturer Part Number: MT9M012
• Description: 1.6Mp CMOS Digital Image Sensor Die
• Manufacturer: Aptina Imaging Corporation

Bonding Instructions
Storage Requirements
PDF: 3518383133/Source: 6156369317
MT9M012_DDS - Rev. C; Pub. 5/10 EN
The MT9M012 imager die has 124 bond pads. Refer to Table 1 and Table 2 on pages 5–10
for a complete list of bond pads and coordinates.
The MT9M012 imager die does not require the user to determine bond option features.
The die also has several pads defined as “do not use.” These pads are reserved for engi-
neering purposes and should not be used. Bonding these pads could result in a
nonfunctional die.
Figure 1 on page 4 shows the MT9M012 typical die connections. For low-noise opera-
tion, the MT9M012 die requires separate supplies for analog and digital power. Power
supply rails should be decoupled to ground using capacitors. The use of inductance
filters is not recommended.
All D
pads. Doing so will minimize risk of damage to the sensor in an ESD event.
Aptina die products are packaged in for shipping a cleanroom environment. Upon
receipt, the customer should transfer the die to a similar environment for storage. Aptina
recommends the die be maintained in a filtered nitrogen atmosphere until removed for
assembly. The moisture content of the storage facility should be maintained at 30
percent relative humidity ±10 percent. ESD damage precautions are necessary during
handling. The die must be in an ESD-protected environment at all times for inspection
and assembly.
GND
pads must be tied together, as must all A
3
MT9M012: 1.6Mp CMOS Digital Image Sensor Die
GND
Aptina reserves the right to change products or specifications without notice.
pads, all V
©2008 Aptina Imaging Corporation. All rights reserved.
DD
Bonding Instructions
_IO pads, and all V
www.DataSheet4U.com
DD