SMB1W-395 Roithner LaserTechnik GmbH, SMB1W-395 Datasheet

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SMB1W-395

Manufacturer Part Number
SMB1W-395
Description
High Power Led, Smd
Manufacturer
Roithner LaserTechnik GmbH
Datasheet
TECHNICAL DATA
SMB1W-395 are InGaN High Power LEDs mounted on a cooper heat sink with a 5x5 mm SMD
package and molded with silicone resin. On forward bias, it emits a radiation of typical 100 mW at
a peak wavelength of 395 nm.
Notes
07.04.2011
Specifications
Absolute Maximum Ratings (T
Power Dissipation
Forward Current
Pulse Forward Current *
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature *
Electro-Optical Characteristics
Forward Voltage
Pulsed Forward Current
Reverse Current
Total Radiated Power
Peak Wavelength
Half Width
Viewing Half Angle
Rise Time
Fall Time
• Do not view directly into the emitting area of the LED during operation!
• The above specifications are for reference purpose only and subjected to change without prior notice.
High Power LED, SMD
Total Radiated Power is measured by S3584-08
*
*
1
2
Structure: InGaN, 1W high power chip
Peak Wavelength: typ. 395 nm
Optical Output Power: typ. 100 mW
Package
duty = 1%, pulse width = 10 µs
must be completed within 5 seconds
SMD, PPA resin
Lead frame die: silver plated on copper
Lens: silicon resin
Item
Item
1
2
Symbol
Symbol
Θ
V
P
Δλ
V
λ
I
t
t
R
T
T
FP
1/2
T
r
O
P
f
P
V
F
I
I
FP
opr
stg
sol
F
D
R
SMB1W-395
a
=25°C)
-30 … +100
I
-30 … +85
I
I
FP
Condition
F
F
I
I
I
I
I
F
F
F
F
F
V
Value
= 200 mA
= 200 mA
1250
= 500 mA
= 50 mA
= 50 mA
= 50 mA
= 50 mA
= 50 mA
350
700
255
R
10
= 5 V
SMB1W-395
Unit
mW
mA
mA
°C
°C
°C
V
Min.
-
-
-
-
-
-
-
-
-
Typ.
100
395
±60
200
150
4.0
4.7
14
-
Max.
4.5
5.5
10
-
-
-
-
-
-
InGaN
(Unit: mm)
Unit
deg.
mW
nm
nm
µA
ns
ns
V
V
1 of 2

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SMB1W-395 Summary of contents

Page 1

... TECHNICAL DATA High Power LED, SMD SMB1W-395 are InGaN High Power LEDs mounted on a cooper heat sink with a 5x5 mm SMD package and molded with silicone resin. On forward bias, it emits a radiation of typical 100 peak wavelength of 395 nm. Specifications • Structure: InGaN, 1W high power chip • ...

Page 2

... LEDs. • All devices, equipment and machinery must be grounded properly recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 07.04.2011 Recommended Land Layout (Unit: mm) Soldering Conditions SMB1W-395 ...

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