CY8C9560 Cypress Semiconductor, CY8C9560 Datasheet - Page 21
CY8C9560
Manufacturer Part Number
CY8C9560
Description
(CY8C9520 - CY8C9560) I/O Expander
Manufacturer
Cypress Semiconductor
Datasheet
1.CY8C9560.pdf
(25 pages)
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www.DataSheet4U.com
This chapter illustrates the packaging specifications for the CY8C95xx device, along with the thermal impedances for each package,
the typical package capacitance on crystal pins, and the solder reflow peak temperature.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/support/link.cfm?mr=poddim.
5.1
August 17, 2005
5.
Packaging Information
Packaging Dimensions
Document No. 38-12036 Rev. *A
Figure 5-1. 28-Lead (210-Mil) SSOP
51-85079 - *C
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