MRF6S23100Hxx Freescale Semiconductor, MRF6S23100Hxx Datasheet

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MRF6S23100Hxx

Manufacturer Part Number
MRF6S23100Hxx
Description
RF Power Dield Effect Transistors
Manufacturer
Freescale Semiconductor
Datasheet
 Freescale Semiconductor, Inc., 2005. All rights reserved.
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N - Channel Enhancement - Mode Lateral MOSFETs
from 2300 to 2400 MHz. Suitable for Class AB feedforward and predistortion
systems.
• Typical 2 - Carrier W - CDMA Performance: V
• Capable of Handling 10:1 VSWR, @ 28 Vdc, 2390 MHz, 100 Watts CW
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Internally Matched for Ease of Use
• Qualified Up to a Maximum of 32 V
• Integrated ESD Protection
• Lower Thermal Resistance Package
• Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
• Low Gold Plating Thickness on Leads, 40
• Pb - Free and RoHS Compliant
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Table 2. Thermal Characteristics
Freescale Semiconductor
Technical Data
1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Drain - Source Voltage
Gate - Source Voltage
Total Device Dissipation @ T
Storage Temperature Range
Operating Junction Temperature
CW Operation
Thermal Resistance, Junction to Case
Designed for 802.16 WiBro and dual mode applications with frequencies
P
3.84 MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF.
Output Power
Applications
Derate above 25°C
Case Temperature 80°C, 100 W CW
Case Temperature 75°C, 20 W CW
the MTTF calculators by product.
Select Documentation/Application Notes - AN1955.
out
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Power Gain — 15.4 dB
Drain Efficiency — 23.5%
IM3 @ 10 MHz Offset — - 37 dBc @ 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset — - 40.5 dBc @ 3.84 MHz Channel Bandwidth
= 20 Watts Avg., Full Frequency Band, Channel Bandwidth =
C
= 25°C
Characteristic
Rating
DD
Operation
µ
″ Nominal.
DD
= 28 Volts, I
DQ
= 1000 mA,
Symbol
Symbol
V
R
V
CW
T
P
DSS
T
θJC
GS
stg
D
J
Document Number: MRF6S23100H
CASE 465A - 06, STYLE 1
MRF6S23100HR3 MRF6S23100HSR3
2300 - 2400 MHz, 20 W AVG., 28 V
CASE 465 - 06, STYLE 1
MRF6S23100HSR3
MRF6S23100HR3
MRF6S23100HSR3
MRF6S23100HR3
LATERAL N - CHANNEL
RF POWER MOSFETs
NI - 780S
NI - 780
- 65 to +150
Value
2 x W - CDMA
- 0.5, +68
- 0.5, +12
Value
0.53
0.59
330
200
100
1.9
(1,2)
Rev. 0, 8/2005
W/°C
°C/W
Unit
Unit
Vdc
Vdc
°C
°C
W
W
1

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MRF6S23100Hxx Summary of contents

Page 1

... Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.  Freescale Semiconductor, Inc., 2005. All rights reserved. RF Device Data Freescale Semiconductor = 28 Volts, I ...

Page 2

... Min Typ Max Unit — — 10 µAdc — — 1 µAdc — — 1 µAdc Vdc 2 2.8 4 Vdc 0.1 0.21 0.3 Vdc — 5.3 — S — 1.5 — Avg 2300 MHz, out 14 15 22.5 23.5 — — dBc - 38 - 40.5 — dBc — — Device Data Freescale Semiconductor ...

Page 3

... V Chip Capacitors (1825 µ Tantalum Capacitor C6 47 µ Tantalum Capacitor C10, C11 10 µ Chip Capacitors (2220) C12 330 µ Electrolytic Capacitor R1 10 Ω, 1/8 W Chip Resistor (1206) RF Device Data Freescale Semiconductor Z10 DUT Z9 ...

Page 4

... Figure 2. MRF6S23100HR3(HSR3) Test Circuit Component Layout MRF6S23100HR3 MRF6S23100HSR3 C10 C11 C12 C7 MRF6S23100 Rev 2.0 RF Device Data Freescale Semiconductor ...

Page 5

... P , OUTPUT POWER (WATTS) PEP out Figure 5. Two - Tone Power Gain versus Output Power RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS η Vdc (Avg.), I = 1000 mA DD out DQ 2−Carrier W−CDMA, 10 MHz Carrier Spacing G ps 3.84 MHz Channel Bandwidth PAR = 8 ...

Page 6

... IM3 −30_C −30 85_C −35 25_C −40 −30_C −45 85_C −50 25_C −55 100 I = 1000 2350 MHz 100 120 140 P , OUTPUT POWER (WATTS) CW out RF Device Data Freescale Semiconductor Actual 160 ...

Page 7

... MHz Bandwidth @ +10 MHz Offset. PAR = 8 0.01% Probability on CCDF 0.001 0.0001 PEAK−TO−AVERAGE (dB) Figure 13. CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 67% Clipping, Single - Carrier Test Signal RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS 100 110 120 130 140 150 160 170 180 190 T , JUNCTION TEMPERATURE (° ...

Page 8

... Z = Test circuit impedance as measured from source gate to ground Test circuit impedance as measured load from drain to ground. Device Input Under Matching Test Network Z Z source load load Ω Output Matching Network RF Device Data Freescale Semiconductor ...

Page 9

... RF Device Data Freescale Semiconductor NOTES MRF6S23100HR3 MRF6S23100HSR3 9 ...

Page 10

... MRF6S23100HR3 MRF6S23100HSR3 10 NOTES RF Device Data Freescale Semiconductor ...

Page 11

... U 4X (FLANGE (FLANGE) D bbb (LID) ccc M (INSULATOR) bbb SEATING T PLANE A A (FLANGE) RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS Q 2X bbb bbb ccc aaa ccc ...

Page 12

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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