MMFT3055VL Motorola, MMFT3055VL Datasheet - Page 8

• Manufacturer Part Number: MMFT3055VL
• Description: TMOS POWER FET 1.5 AMPERES 60 VOLT
• Manufacturer: Motorola

circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass or
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
MMFT3055VL
8
Prior to placing surface mount components onto a printed
The melting temperature of solder is higher than the rated
Always preheat the device.
The delta temperature between the preheat and soldering
When preheating and soldering, the temperature of the
should be 100 C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10 C.
SOLDER STENCIL GUIDELINES
SOLDERING PRECAUTIONS
stainless steel with a typical thickness of 0.008 inches. The
stencil opening size for the SOT–223 package should be the
same as the pad size on the printed circuit board, i.e., a 1:1
registration.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
The soldering temperature and time shall not exceed
When shifting from preheating to soldering, the maximum
After soldering has been completed, the device should be
Mechanical stress or shock should not be applied during
Motorola TMOS Power MOSFET Transistor Device Data
260 C for more than 10 seconds.
temperature gradient shall be 5 C or less.
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
cooling