UPD78323 NEC, UPD78323 Datasheet - Page 76

• Manufacturer Part Number: UPD78323
• Description: 16/8-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

76
11. RECOMMENDED SOLDERING CONDITIONS
ing Technology Manual (IE1-1207).
Note For the storage period after dry-pack decompression, storage conditions are max. 25 C, 65 % RH.
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
PD78323GJ-5BJ
PD78324GJ-
PD78323LP
PD78324LP-
Pin part heating
Infrared reflow
VPS
Pin part heating
Infrared reflow
VPS
The PD78323 and 78324 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document Semiconductor Device Mount-
For soldering methods and conditions other than those recommended below, contact our salesman.
Soldering Method
Soldering Method
-5BJ : 74-pin plastic QFP (20
: 68-pin plastic QFJ (
: 68-pin plastic QFJ (
: 74-pin plastic QFP (20
Package peak temperature: 235 C, Time: 30 sec. max. (at 210 C or above)
Number of times: twice or less, Time limit: 7 days
prebaking required at 125 ˚C)
<Caution>
(1) The second reflow should be started after the temperature of the device
(2) Please avoid flux water washing after the first reflow.
Package peak temperature: 215 C, Time: 40 sec. max. (at 200 C or above),
Number of times: twice or less, Time limit: 7 days
prebaking required at 125 ˚C)
<Caution>
(1) The second reflow should be started after the temperature of the device
(2) Please avoid flux water washing after the first reflow.
Pin temperature: 300 C max., Time: 3 sec. max. (Per side of the device))
Package peak temperature: 230 C, Time: 30 sec. max. (at 210 C or above)
Number of times: Once, Time limit: 7 days
required at 125 C)
Package peak temperature: 215 C, Time: 40 sec. max. (at 200 C or above)
Number of times: Once, Time limit: 7 days
required at 125 C)
Pin temperature: 300 C max, Time: 3 sec. max. (Per side of the device)
Table 11-1. Soldering Conditions for Surface Mount Type
which would have been changed by the first reflow has returned to normal.
which would have been changed by the first reflow has returned to normal.
950 mil)
950 mil)
Soldering Conditions
Soldering Conditions
20 mm)
20 mm)
Note
Note
(thereafter 10 hours prebaking
(thereafter 10 hours prebaking
Note
Note
(thereafter 36 hours
(thereafter 36 hours
PD78323, 78324
Condition Symbol
Condition Symbol
Recommended
Recommended
VP15-367-2
IR30-107-1
VP15-107-1
IR30-367-2