upd78f0114m6gb-8es Renesas Electronics Corporation., upd78f0114m6gb-8es Datasheet - Page 484

• Manufacturer Part Number: upd78f0114m6gb-8es
• Description: 8-bit Single-chip Microcontrollers
• Manufacturer: Renesas Electronics Corporation.

sales representative.
µ
µ
µ
µ
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
484
Infrared reflow
VPS
Wave soldering
Partial heating
PD780111GB-×××-8ES, 780112GB-×××-8ES, 780113GB-×××-8ES, 780114GB-×××-8ES,
PD780111GB(A)-×××-8ES, 780112GB(A)-×××-8ES, 780113GB(A)-×××-8ES, 780114GB(A)-×××-8ES,
PD780111GB(A1)-×××-8ES, 780112GB(A1)-×××-8ES, 780113GB(A1)-×××-8ES, 780114GB(A1)-×××-8ES,
PD780111GB(A2)-×××-8ES, 780112GB(A2)-×××-8ES, 780113GB(A2)-×××-8ES, 780114GB(A2)-×××-8ES
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Table 30-1. Surface Mounting Type Soldering Conditions (1/2)
Note
(after that, prebake at 125°C for 10 hours)
User’s Manual U16227EJ3V0UD
Soldering Conditions
Note
Note
(after that, prebake at 125°C for 10
(after that, prebake at 125°C for 10
IR35-107-2
VP15-107-2
WS60-107-1
Condition Symbol
Recommended
−