mt46h32m32lfcg-6it Micron Semiconductor Products, mt46h32m32lfcg-6it Datasheet

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mt46h32m32lfcg-6it

Manufacturer Part Number
mt46h32m32lfcg-6it
Description
152-ball Package-on-package Pop Ti-omap
Manufacturer
Micron Semiconductor Products
Datasheet

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Part Number:
mt46h32m32lfcg-6it:A
Quantity:
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Mobile LPDDR (only)
152-Ball Package-on-Package (PoP) TI-OMAP™
MT46HxxxMxxLxCG
MT46HxxxMxxLxKZ
Features
• Vdd
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR)
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data—one mask
• Programmable burst lengths (BLs): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• On-chip temperature sensor to control self refresh
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• STATUS REGISTER READ (SRR) supported
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh
Table 1:
PDF: 09005aef833913f1/Source: 09005aef833913d6
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. D 01/09 EN
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Architecture
Configuration
Refresh count
Row addressing
Column addressing
architecture; 2 data accesses per clock cycle
aligned with data for WRITEs
per byte
rate
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
/
Vddq = 1.70–1.95V
Configuration Addressing
Notes:
x 4 banks x 4 die
128 Meg x 32
16K (A[13:0])
16 Meg x 16
1K (A[9:0])
1. Quad die stack. Each CS configured with two x16 die connected in parallel to make up a 32-bit-
8K
wide bus.
1
2
x 4 banks x 2 die
64 Meg x 32
1
8K (A[12:0])
1K (A[9:0])
8 Meg x 32
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
8K
1
Options
• Vdd/Vddq
• Configuration
• Device version
• Plastic “green” package
• Timing – cycle time
• Operating temperature range
Notes: 1. BL 16: contact factory for availability.
– 1.8V/1.8V
– 128 Meg x 32 (16 Meg x 16 x 4 banks x 4)
– 64 Meg x 32 (8 Meg x 32 x 4 banks x 2)
– 32 Meg x 32 (8 Meg x 32 x 4 banks)
– 16 Meg x 32 (4 Meg x 32 x 4 banks)
– Single die, standard addressing
– 2-die stack, standard addressing
– 4-die stack, standard addressing
– 152-ball VFBGA
– 152-ball VFBGA
– 5ns @ CL = 3
– 5.4ns @ CL = 3
– 6ns @ CL = 3
– Commercial (0° to +70°C)
– Industrial (–40°C to +85°C)
(14mm x 14mm x 1.0mm)
(14mm x 14mm x 1.2mm
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Contact factory for remapped SRR output.
32 Meg x 32
8K (A[12:0])
1K (A[9:0])
8 Meg x 32
x 4 banks
8K
©2008 Micron Technology, Inc. All rights reserved.
16 Meg x 32
8K (A[12:0])
512 (A[8:0])
4 Meg x 32
x 4 banks
8K
Preliminary
Features
Marking
128M32
64M32
32M32
16M32
None
CG
-54
KZ
LF
L2
L4
-5
-6
IT
H

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mt46h32m32lfcg-6it Summary of contents

Page 1

Mobile LPDDR (only) 152-Ball Package-on-Package (PoP) TI-OMAP™ MT46HxxxMxxLxCG MT46HxxxMxxLxKZ Features • Vdd Vddq = 1.70–1.95V / • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR) architecture; 2 data accesses per clock cycle • ...

Page 2

Part Numbering Information – 152-Ball PoP Micron Figure 1: Marketing Part Number Example MT Micron Technology Product Family 46 = LPDDR-SDRAM Operating Voltage H = 1.8V/1.8V Configuration 128 Meg Meg Meg ...

Page 3

... Table 2: 152-Ball Production Marketing Part Numbers Part Numbers MT46H16M32LFCG-5:B MT46H16M32LFCG-5 IT:B MT46H16M32LFCG-54:B MT46H16M32LFCG-54 IT:B MT46H16M32LFCG-6:B MT46H16M32LFCG-6 IT:B MT46H32M32LFCG-5:A MT46H32M32LFCG-5 IT:A MT46H32M32LFCG-54:A MT46H32M32LFCG-54 IT:A MT46H32M32LFCG-6:A MT46H32M32LFCG-6 IT:A MT46H64M32L2CG-5:A MT46H64M32L2CG-5 IT:A MT46H64M32L2CG-54:A MT46H64M32L2CG-54 IT:A MT46H64M32L2CG-6:A MT46H64M32L2CG-6 IT:A MT46H128M32L4KZ-6 IT ES:A Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device ...

Page 4

General Description Micron 152-ball packaged Mobile Low-Power DDR SDRAM (LPDDR) devices contain either 1Gb LPDDR or 512Mb LPDDR die. The 1Gb LPDDR die is a high-speed CMOS, dynamic random-access memory containing 1,073,741,824 bits internally configured as a quad-bank ...

Page 5

Ball Assignments and Descriptions Figure 3: 152-Ball VFBGA Ball Assignments Vddq DM1 DQ13 DQ15 DQ6 DQ7 VDDQ DQ9 C Vssq DQS0 D DQ3 DQ5 E DQ0 DQ1 F ...

Page 6

Table 3: Ball Assignments Ball Numbers Symbol AA15, R21, N21, Y16, A[13:0] K21, N20, M20, M21, R20, U21, J21, J20, K20, G20 AA18, V20 BA0, BA1 U20 CAS# A12, B13 CK, CK# Y15, Y13 CKE0, CKE1 T21, T20 CS0#, CS1# ...

Page 7

Table 4: Non-Device-Specific Ball Assignments Shared Balls Symbol A13, H2, H20, M2, P20, Vss R2, Y6, Y11, Y17, AA7, AA13 Miscellaneous Balls Y1, Y21 DNU A1, A2, A20, A21, B1, NC B2, B20, B21, J2, K1, K2, L1, L2, M1, ...

Page 8

Device Diagrams Figure 4: 152-Ball VFBGA Functional Block Diagram (non-Quad Die) CS# CK# CKE RAS# CAS# WE# Address, BA0, BA1 PDF: 09005aef833913f1/Source: 09005aef833913d6 ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. D 01/09 EN 152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP) CK LPDDR Micron Technology, ...

Page 9

Figure 5: 152-Ball VFBGA Functional Block Diagram, Quad Die CS0# CK# CKE0 RAS# CAS# WE# Address, BA0, BA1 CS1# CK# CKE1 RAS# CAS# WE# Address, BA0, BA1 PDF: 09005aef833913f1/Source: 09005aef833913d6 ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. D 01/09 EN 152-Ball x32 Mobile LPDDR ...

Page 10

Package Dimensions Figure 6: 152-Ball VFBGA Package, 1.0mm (Package Code: CG) Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. ...

Page 11

Figure 7: 152-Ball VFBGA Package, 1.2mm (Package Code: KZ) Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0.35 SMD ball pads ...

Page 12

Revision History Rev. D, Preliminary ...

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