mc100es6535 Integrated Device Technology, mc100es6535 Datasheet - Page 5

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mc100es6535

Manufacturer Part Number
mc100es6535
Description
Lvcmos-input Lvpecl-output 1-ghz 3.3v 1 4 Fanout Buffer
Manufacturer
Integrated Device Technology
Datasheet
IDT™ 3.3V LVCMOS to LVPECL 1:4 Fanout Buffer
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
MC100ES6535
3.3V LVCMOS to LVPECL 1:4 Fanout Buffer
TIMING SOLUTIONS
0.15 (0.006) T
0.15 (0.006) T
0.15 (0.006) T
0.15 (0.006) T
L
L
2X
2X
–T–
PIN 1
PIN 1
IDENT
IDENT
U
U
U
U
L/2
L/2
S
S
C
S
S
0.100 (0.004)
SEATING
PLANE
D
20
20X
20X
Freescale Semiconductor, Inc.
0.10 (0.004)
0.10 (0.004)
-V-
-V-
K
K
A
A
For More Information On This Product,
REF
REF
G
H
M
M
11
10
T
T
U
U
20-LEAD TSSOP PACKAGE
OUTLINE DIMENSIONS
-U-
-U-
S
S
B
B
V
V
CASE 948E-02
S
DT SUFFIX
TSSOP-20
ISSUE A
J J1
N
5
5
N
DETAIL E
SECTION N-N
F
K1
0.25 (0.010)
DETAIL E
K
M
-W-
NOTES:
1.
2.
3.
4.
5.
6.
7.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND BE ARE TO BE DETERMINED
AT DATUM PLANE -W-.
DIM
K1
J1
M
A
B
C
D
G
H
K
F
J
L
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
---
0.65 BSC
6.40 BSC
MAX
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
6.60
4.50
0.252
0.169
0.002
0.020
0.011
0.004
0.004
0.007
0.007
MIN
MC100ES6535
---
0.026 BSC
0.252 BSC
INCHES
MC100ES6535
MAX
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
NETCOM
MOTOROLA

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