adsp-21364bbc Analog Devices, Inc., adsp-21364bbc Datasheet - Page 46

• Manufacturer Part Number: adsp-21364bbc
• Description: Sharc Processor
• Manufacturer: Analog Devices, Inc.

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
THERMAL CHARACTERISTICS
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page
Table 42
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA) and JESD51-5 (LQFP_EP). The junction-to-case mea-
surement complies with MIL-STD-883. All measurements use a
2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
Industrial applications using the LQFP_EP package require
thermal trace squares and thermal vias, to an embedded ground
plane, in the PCB. Refer to JEDEC standard JESD51-5 for more
information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
T
package
Ψ
is the typical value from
P
21362 SHARC Processors (EE-277) for more information.
D
J
T
JT
= junction temperature (°C)
= case temperature (°C) measured at the top center of the
= power dissipation. See Estimating Power for the ADSP-
= junction-to-top (of package) characterization parameter
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
- 2
- 4
10
8
6
4
2
0
16.
through
0
y = 0.0488x - 1.5923
Table 44
T
(at Ambient Temperature)
50
J
=
Table 42
T
airflow measurements comply with
T
LOAD CAPACITANCE (pF)
+
(
Ψ
through
100
JT
×
P
D
)
Table
150
44.
Rev. D | Page 46 of 56 | April 2008
200
Values of θ
design considerations.
Values of θ
design considerations when an exposed pad is required. Note
that the thermal characteristics values provided in
throughTable 44
Table 42. Thermal Characteristics for BGA (No Thermal vias
in PCB)
Table 43. Thermal Characteristics for BGA (Thermal vias in
PCB)
Table 44. Thermal Characteristics for LQFP_EP (with
Exposed Pad Soldered to PCB)
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
JT
JMT
JMT
JA
JC
are provided for package comparison and PCB
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
are modeled values.
Typical
25.40
21.90
20.90
5.07
0.140
0.330
0.410
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Typical
16.80
14.20
13.50
7.25
0.51
0.72
0.80
Table 42
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W