mc33288ddh/r2 Freescale Semiconductor, Inc, mc33288ddh/r2 Datasheet - Page 9

• Manufacturer Part Number: mc33288ddh/r2
• Description: Solid State Relay For Automotive Flasher Applications
• Manufacturer: Freescale Semiconductor, Inc

terminal and then tied to a microcontroller A/D input for
analog voltage measurement. The CUR R terminal is
internally clamped to protect the MCU A/D input.
Warning Lamp Driver
high-side MOSFET to control the 1.2 W dashboard warning
lamp. This output is current limited and thermally
protected-activated only in the warning mode. It is turned on
by activation of both right and left inputs (IN1 and IN2).
Package
package. This package offers high thermal performances
and high current capabilities. It offers 10 terminals on each
package sides and an additional terminal which is the
package heat sink , called terminal 21. The heak sink acts as
the MC33288 power V
Soldering Information
package indended to be soldered directly on the Printed
Circuit Board.
JESD22-A113-B and J-STD-020A with the reflow conditions
applicable for packages with thickness above 2.5 mm:
process should not exceed 220°C (+5°C/-0°C). The time at
maximum temperature should range from 10 to 40s
maximum.
Thermal Management
maximum. The junction to ambient thermal resistance is
dependent on the mounting technology and the addition of
heat sink. One of the most commonly used mounting
techniques consists of using the printed circuit board and the
copper lines as heat sink.
Analog Integrated Circuit Device Data
Freescale Semiconductor
An external resistor must be connected to the CUR R
The warning lamp driver is a 3.2 Ω R
The device is assembled into a power surface mount
This device is packaged in a Surface Mount Power
This device was qualified according to JEDEC standards
Convection 220°C +5/-0°C
VPR 215-219°C
IR / Convection 220°C +5/-0°C
The maximum peak temperature during the soldering
The junction to case thermal resistance is 2°C/W
BAT
connection.
This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values
DSON
maximum
It has a total of 10 cm
cm
ambient of 25°C/W can be achieved, this value being split
into:
thicker copper metal, higher number of thermal via from top
to down side pcb and the use of additional thermal via from
the circuit board to the module case.
Steady State Thermal Model
mounted on a printed circuit board can be split into two main
parts: junction to case and case to ambient resistances.
Figure 3. Printed Board Layout Example (not to scale)
Figure 1 shows an example of printed circuit board layout.
With the above layout, thermal resistance junction to
• junction to case : R
• case to ambient : R
Lower value can be reached with the help of larger and
The junction to ambient thermal resistance of the circuit
A simplified steady state model is shown in Figure 2.
2
on the top side and 7.5 cm
Power Dissipation)
Figure 4. Simplified Thermal Model (Electrical
(1.0A=1W of
top to down
Power (W)
HSOP20
Surface Temperature)
Chan 1
Down side pcb
Thermal
side pcb
via from
(Volts represent Die
Chan 1 Junction
Temp Node
8 cm
(1.0Ω=1°C/W)
(1.0V=1°C)
2
2
additional copper on two sides (2.5
θJC1
25°C/W
Rthca
θCA
Equivalent)
Chan 1
Switch
FUNCTIONAL DEVICE OPERATION
2°C/W
R
= 23°C/W
θJC1
= R
external pcb (4x4 cm)
2
θJC2
on the down side).
Case Temp Node
Ambient Temp Node
AmbientTemperature
= 2°C/W
Chan 2 Junction
OPERATIONAL MODES
Temp Node
Chan 2
Switch
2°C/W
R
θJC2
Top side pcb
2 cm
Power (W)
2
Chan 2
33288
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