mc33662 Freescale Semiconductor, Inc, mc33662 Datasheet

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mc33662

Manufacturer Part Number
mc33662
Description
Lin 2.1 / Saej2602-2, Lin Physical Layer
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Freescale Semiconductor
Advance Information
© Freescale Semiconductor, Inc., 2011. All rights reserved.
LIN 2.1 / SAEJ2602-2, LIN
Physical Layer
protocol, designed to support automotive networks in conjunction with
a Controller Area Network (CAN). As the lowest level of a hierarchical
network, LIN enables cost-effective communication with sensors and
actuators when all the features of CAN are not required.
maximum baud rates. The MC33662LEF and MC33662SEF offer a
normal baud rate (20 kbps), and the MC33662JEF, a slow baud rate
(10 kbps). They integrate a fast baud rate (above 100 kbps), as
reported by the RXD pin for test and programming modes. They provide
excellent EMC (Electromagnetic Compatibility) and Radiated Emission
performance, ESD (Electrostatic Discharge) robustness, and safe
behavior, in the event of a LIN bus short-to-ground, or a LIN bus
leakage during low-power mode.
Features
• Operational from a V
• Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and
• Active bus wave shaping, offering excellent radiated emission
• Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus,
• Very high immunity against electromagnetic interference
• Low standby current in Sleep mode
• Over-temperature protection
• Local and remote Wake-up capability reported by the RXD pin
• Fast baud rate selection reported by RXD pin
• 5.0 V and 3.3 V compatible digital inputs without any required external components
The Local Interconnect Network (LIN) is a serial communication
The three 33662 versions are designed to operate at different
and handles 40 V during Load Dump
SAEJ2602-2
performance
20 kV on the WAKE pin, and 25 kV on the VSUP pin
SUP
of 7.0 to 18V DC, functional up to 27V DC,
CAN SBC
Regulator
12 V
Figure 1. 33662 Master LIN Bus Simplified Application Diagram
or 3.3 V
or
5.0 V
V
DD
MCU
EN
RXD
TXD
WAKE
33662
GND
VSUP
Tape and Reel orders)
(Add an R2 suffix for
INH
LIN
MC33662SEF
MC33662LEF
MC33662JEF
Device
V
BAT
ORDERING INFORMATION
LIN Interface
EF SUFFIX (PB-FREE)
Document Number: MC33662
33662
98ASB42564B
LINCELL
8-PIN SOICN
Temperature
- 40 to 125°C
Range (T
Rev. 4.0, 9/2011
A
)
Package
8 SOICN

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mc33662 Summary of contents

Page 1

... The three 33662 versions are designed to operate at different maximum baud rates. The MC33662LEF and MC33662SEF offer a normal baud rate (20 kbps), and the MC33662JEF, a slow baud rate (10 kbps). They integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide ...

Page 2

... DEVICE VARIATIONS Table 1. Device Variations Freescale Part No. (Add an R2 suffix for Tape and Reel orders) MC33662LEF MC33662SEF MC33662JEF 33662 2 DEVICE VARIATIONS Temperature Range (T Maximum Baud Rate 20 kbps 20 kbps with restricted limits for transmitter and receiver symmetry 10 kbps ) Package 125°C ...

Page 3

200 kΩ RXD TXD WAKE Figure 2. 33662 Simplified Internal Block Diagram Analog Integrated Circuit Device Data Freescale Semiconductor INTERNAL BLOCK DIAGRAM INH_ON EN-SLEEP Control Unit RXD_INT EN_RXD LIN_EN 35 μΑ TXD_INT INTERNAL BLOCK DIAGRAM VSUP INH ...

Page 4

PIN CONNECTIONS Table 2. 33662 8-SOICN Pin Definitions A functional description of each pin can be found in the Pin PIN NAME Pin Function 1 RXD Output 2 EN Input 3 WAKE Input 4 TXD Input 5 GND Ground 6 ...

Page 5

Table 3. Maximum Ratings All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS Power Supply Voltage Normal Operation (DC) Transient input voltage with ...

Page 6

ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings (continued) All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS (CONTINUED) ESD Capability - AECQ100 ...

Page 7

Table 4. Limits / Maximum Test Voltage for Transient Immunity Tests Test Pulse V [ -100 2a +75 3a -150 3b +100 DUT GND Figure 4. Test Circuit for Transient Test Pulses (VSUP) DUT DUT GND Figure 5. ...

Page 8

ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS DUT GND Figure 7. Test Circuit for Transient Test Pulses (INH) 33662 8 DUT Transient Pulse 1.0 nF Generator INH Note Waveform per ISO 7637-2. Test Pulses 1, 2a, 3a, 3b. (Note) GND Analog Integrated Circuit ...

Page 9

STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristics Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic VSUP PIN (DEVICE POWER SUPPLY) Nominal Operating Voltage (4) Functional Operating Voltage Load Dump Power-On Reset ...

Page 10

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristics (continued) Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic LIN PHYSICAL LAYER - TRANSCEIVER LIN (6) Operating Voltage Range Supply Voltage Range ...

Page 11

Table 5. Static Electrical Characteristics (continued) Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic INH OUTPUT PIN Driver ON Resistance (Normal Mode INH Current load capability From 7.0 ...

Page 12

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTIC DYNAMIC ELECTRICAL CHARACTERISTIC Table 6. Dynamic Electrical Characteristics Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic LIN PHYSICAL LAYER DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 ...

Page 13

Table 6. Dynamic Electrical Characteristics (continued) Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic Notes 1 1.0 kΩ, 6 660 Ω 500 Ω. Measurement thresholds: ...

Page 14

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTIC Table 6. Dynamic Electrical Characteristics (continued) Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic LIN PHYSICAL LAYER RECEIVER CHARACTERISTICS WITH TIGHTEN LIMITS 33662S DEVICE (21) Propagation Delay ...

Page 15

Table 6. Dynamic Electrical Characteristics (continued) Characteristics under conditions 7.0 V ≤ V values reflect the approximate parameter means at T Characteristic Notes 20. V from 7 bus load R SUP BUS signal to LIN signal threshold ...

Page 16

ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TXD TBIT t BUS_DOM V LIN_REC 74. SUP REC(MAX) 58. SUP DOM(MAX) LIN 42. SUP REC(MIN) 28. SUP DOM(MIN) RXD Output of receiving Node 1 t REC_PDF(1) RXD ...

Page 17

TXD V LIN_REC V BUSREC V BUSDOM t TRAN_PDF60% t TRAN_PDF40% V LIN_REC 60 SUP BUSREC 40% V SUP V BUSDOM RXD t REC_PDF V LIN_REC 60 SUP BUSREC 40% V SUP V BUSDOM RXD t ...

Page 18

ELECTRICAL CHARACTERISTICS FUNCTIONAL DIAGRAMS EN INH t LWUE TXD t FIRST_DOM LIN RXD (High Z) WAKE Figure 14. EN Pin Wake-up with TXD High WAKE WAKE after deglitcher t WF INH t FIRST_DOM EN TXD LIN RXD Awake Mode (High ...

Page 19

WAKE WAKE after deglitcher t WF INH t FIRST_DOM EN TXD LIN RXD Awake Mode (High Z) Figure 18. WAKE Pin Wake-up with TXD Low INH EN TXD LIN RXD WAKE Device in Communication Mode Figure 20. LIN Bus Wake-up ...

Page 20

ELECTRICAL CHARACTERISTICS FUNCTIONAL DIAGRAMS EN pin EN internal signal EN pin EN internal signal EN pin EN internal signal EN TXD LIN RXD Figure 22. Fast Baud Rate Selection (Toggle Function) EN TXD (12.5 μ LIN RXD Figure ...

Page 21

VSUP POR (3.5-5.3 V) 160 µs EN INH t FIRST_DOM (High or Low) TXD LIN Awake Mode RXD (High Z) *: this parameter is guaranteed by design INH EN TXD LIN RXD WAKE WAKE after deglitcher Analog Integrated Circuit Device ...

Page 22

ELECTRICAL CHARACTERISTICS FUNCTIONAL DIAGRAMS INH t LWUE EN TXD No communication LIN allowed (High Z) RXD WAKE (case 1) WAKE after deglitcher (case 1) Preparation to Device in Sleep Mode Communication Mode t < The device does not ...

Page 23

The 33662L, 33662J, and 33662S are a physical layer component dedicated to automotive LIN sub-bus applications. The 33662L and 33662S features include a 20 kbps baud rate and the 33662J a 10 kbps baud rate. They integrate fast baud rate ...

Page 24

FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION Rate exit (See Figure 23). The device enters into Fast Baud Rate at room and hot temperature. DATA INPUT PIN (TXD) The TXD input pin is the MCU interface to control the state of the ...

Page 25

FUNCTIONAL DEVICE OPERATION As described below and depicted in Table 7, the 33662L, 33662J, and 33662S have two operational modes, Normal and Sleep. In addition, there are two transitional modes: Awake mode and Preparation to Sleep mode. The Awake mode ...

Page 26

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES transition. This is illustrated in Figure 16 wake-up is detected (during the dominant to recessive transition), the device enters into Awake mode, with INH HIGH and RXD pulled LOW. Once in the Awake mode, the ...

Page 27

Power Up V > V SUP POR EN LOW to HIGH for t > t Awake Internal WAKE changes during t LIN bus dominant pulse (31) for t > t WUF or WAKE pin state (32) changes for t > ...

Page 28

TYPICAL APPLICATIONS The 33662 can be configured for several applications. Figure 30 and 31 show master and slave node applications. An additional pull-up resistor of 1.0 kΩ in series with a diode C1 D1 VBAT 22µ 2.2kΩ ...

Page 29

Important For the most current revision of the package, visit www.Freescale.com and do a keyword search on the 98A drawing number below. Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS EF SUFFIX 8-PIN 98ASB42564B REVISION V PACKAGING PACKAGE ...

Page 30

PACKAGING PACKAGE DIMENSIONS 33662 30 EF SUFFIX 8-PIN 98ASB42564B REVISION V Analog Integrated Circuit Device Data Freescale Semiconductor ...

Page 31

REVISION DATE 3.0 8/2011 4.0 9/2011 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY DESCRIPTION OF CHANGES Initial release Changed the PC part numbers in the Ordering Information Table to MC REVISION HISTORY PACKAGE DIMENSIONS 33662 31 ...

Page 32

... Limited. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. All other product or service names are the property of their respective owners. ©2011 Freescale Semiconductor, Inc. MC33662 Rev. 4.0 9/2011 ...

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